Micro LED Layer Bonding for Thin Substrate Breakage Control
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Solution Overview
Problem
The manufacturing of micro LED devices faces challenges due to the fragility of large-area substrates during the thin wafer process, leading to increased compressive and tensile stress, which can result in substrate breakage and strain during handling and deposition/etching processes.
Innovation Solution
A micro LED device structure is developed with a support substrate, a light emitting layer, and a drive layer, where the light emitting layer is bonded to the support substrate after growth on a growth substrate, allowing for the complete removal of the growth substrate and subsequent processes like forming the drive layer and color conversion layer, reducing process stress and enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the thickness of the epitaxial substrate is reduced to approximately half through a thin wafer process, then the substrate becomes more advantageous in fabrication process handling, but compressive and tensile stress greatly increase and breakage may occur during handling and deposition/etching processes
Solution Approach 1:
A bonding layer is introduced as an intermediary between the light emitting layer and the support substrate. This bonding layer allows the thin light emitting layer to be securely attached to a robust support substrate, providing mechanical strength during handling and processing while enabling the overall structure to be manufactured with reduced substrate thickness for fabrication advantages.
2Productivity
If a large-area substrate is used as an epitaxial substrate, then process yield is improved, but the substrate thickness and weight make the process difficult to perform
Solution Approach 1:
The substrate system is segmented into two separate components: a large-area epitaxial substrate used for growing the light emitting layer and a separate support substrate that provides mechanical strength. After the light emitting layer is grown and bonded to the support substrate, the epitaxial substrate can be removed. This segmentation allows the benefits of large-area substrates for high yield while eliminating the handling difficulties of thick, heavy substrates.
Data Source
AI summary
A micro light emitting diode (LED) device and a method of manufacturing the same are provided. A micro LED device includes a light emitting layer that is provided on a support substrate, a bonding layer, and a driver layer. The light emitting layer includes a stacked structure including a first semiconductor layer, an active layer, and a second semiconductor layer; first and second electrodes provided on a first side and a second side of the stacked structure; and a plurality of light emitting regions. The bonding layer is positioned between the support substrate and the light emitting layer. The drive layer includes a drive element electrically connected to the light emitting layer and is positioned on the light emitting layer to apply power to the plurality of light emitting regions of the light emitting layer.