Micro-LED Chip Structure With Shared Emission Layer Isolation
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Solution Overview
Problem
Existing micro-LED structures face challenges in optimizing the arrangement of conductive layers and light emitting layers to enhance efficiency and prevent electrical short circuits, particularly in micro-LED chips with multiple LEDs.
Innovation Solution
The micro-LED structure features a unique arrangement where the light emitting layer extends horizontally away from the edges of the conductive layers without contacting them, with alignment and spacer structures to ensure separation, and a shared light emitting layer across multiple LEDs with isolation structures for improved electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light emitting layer contacts the conductive layers directly, then the electrical connection is improved, but electrical short circuits occur between adjacent LEDs
Solution Approach 1:
The patent introduces a horizontal extension dimension for the light emitting layer, allowing it to extend away from the conductive layers in the horizontal direction while maintaining vertical electrical connection. This dimensional change enables both electrical connection and isolation simultaneously by separating the vertical conduction path from horizontal isolation regions.
Solution Approach 2:
The light emitting layer acts as an intermediary structure that extends horizontally to create isolation regions between adjacent LEDs. This extension creates intermediate zones that prevent direct electrical contact between neighboring devices while maintaining the necessary electrical connection to the conductive layers below.
2Ease of manufacture
If multiple LEDs share a continuous light emitting layer, then manufacturing complexity is reduced, but electrical isolation between LEDs becomes difficult
Solution Approach 1:
The continuous light emitting layer is functionally segmented into distinct LED regions through horizontal extension patterns. Each LED has its own extended light emitting layer region that is spatially separated from adjacent LEDs, creating natural electrical isolation zones while maintaining manufacturing simplicity through a continuous layer structure.
Solution Approach 2:
The light emitting layer extends in the horizontal dimension to create isolated regions for each LED. This horizontal extension transforms a potentially problematic continuous vertical structure into a segmented structure with built-in isolation, achieving both manufacturing ease and electrical isolation.
3Area of stationary object
If the conductive layers are positioned closer together, then device area is reduced, but electrical short circuits increase
Solution Approach 1:
The light emitting layer extends horizontally to create isolation barriers between closely spaced conductive layers. This horizontal extension adds a dimensional barrier that prevents electrical short circuits even when vertical spacing is minimized, enabling compact chip design without sacrificing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the efficiency and reliability of micro-LEDs by preventing short circuits and enabling uniform light emission across multiple LEDs, improving overall performance and reducing manufacturing complexity.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further comprises an isolation structure formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer. A top surface of the isolation structure is above the light emitting layer. A bottom surface of the isolation structure is aligned with a bottom of the light emitting layer.