Micro-LED Layer Layout for Uniform Emission in Dense Chips
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Solution Overview
Problem
Existing micro-LED structures face challenges in optimizing the arrangement of conductive layers and light emitting layers to enhance efficiency and integration, particularly in micro-LED chips where adjacent LEDs may interfere with each other's light emission.
Innovation Solution
The micro-LED structure and chip designs involve stacking conductive layers with a light emitting layer that extends horizontally away from the edges of the conductive layers, ensuring non-contact alignment and optionally incorporating spacers and isolation structures to separate adjacent LEDs, allowing continuous light emission across the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light emitting layer contacts the conductive layers directly, then the device structure is simpler, but light emission efficiency decreases due to interference and non-uniformity
Solution Approach 1:
The patent introduces an intermediary layer between the light emitting layer and conductive layers, which acts as a mediator to prevent direct contact. This intermediary structure reduces optical interference and improves light emission efficiency while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
The patent transitions from a two-dimensional planar contact structure to a three-dimensional elevated structure by extending the light emitting layer horizontally away from the conductive layer edges. This dimensional change creates spatial separation that improves light emission uniformity and efficiency.
2Productivity
If multiple micro-LEDs are integrated closely on a chip, then device density increases, but light emission uniformity decreases due to mutual interference
Solution Approach 1:
The patent divides the chip into discrete micro-LED units with clearly defined boundaries. Each micro-LED is structured as an independent unit with separated conductive and light emitting layers, preventing optical interference between adjacent devices while maintaining high integration density.
Solution Approach 2:
The patent applies different structural characteristics to different regions: the light emitting layer extends horizontally away from conductive layer edges in each local micro-LED region, creating localized optimization for light emission uniformity while maintaining overall high density integration across the chip.
3Illumination intensity
If the light emitting layer extends horizontally away from conductive layer edges, then light emission uniformity improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes predetermined alignment relationships between layers during the design stage, such as defining specific horizontal extension distances of the light emitting layer from conductive layer edges. These preliminary design specifications guide the manufacturing process and reduce the actual precision requirements during fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light emission efficiency and facilitates the integration of multiple micro-LEDs on a chip by minimizing interference, improving brightness and uniformity of light output.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED structure includes a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer extends along a horizontal level from an edge of the first type conductive layer. An edge of the light emitting layer is aligned with an edge of the second type conductive layer. The edge of the second type conductive layer extends along the horizontal level away from the edge of the first type conductive layer.