Micro LED Transfer Structure With Preformed Light Blocking Layers
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Solution Overview
Problem
Conventional micro light emitting diode structures face damage and low yield during the fabrication of light blocking structures due to lithography processes, leading to poor structural reliability and efficiency.
Innovation Solution
A micro light emitting diode structure with light blocking structures that include a light blocking layer and a light shielding layer, where the reflectivity and Young's modulus of the light blocking layer are greater than those of the connection layer, allowing for alternate arrangement and secure fixation on a temporary substrate, enhancing structural reliability and manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light blocking structure is manufactured after the micro light emitting diode is transferred onto the temporary substrate using lithography processes, then the light blocking structure can be formed, but the micro light emitting diode may be damaged easily and the structural reliability is poor
Solution Approach 1:
The light blocking structure is manufactured on the first substrate before the micro light emitting diode is transferred onto the temporary substrate. This preliminary fabrication avoids subsequent lithography damage to the already-transferred micro light emitting diode, thereby improving structural reliability while preventing device damage.
2Productivity
If the light blocking structure is manufactured on the temporary substrate, then the structure can be completed, but the efficiency of development and peeling is poor and the yield is low
Solution Approach 1:
The manufacturing process is segmented into separate stages: the light blocking structure is fabricated on a first substrate, the micro light emitting diode is transferred to a temporary substrate, and then the light blocking structure is transferred to the temporary substrate. This segmentation allows each component to be optimized independently, improving both manufacturing efficiency and structural reliability.
Solution Approach 2:
A temporary substrate is introduced as an intermediary carrier during the transfer process. The light blocking structure is first formed on a first substrate, then transferred to the temporary substrate which serves as a handling and alignment medium, enabling efficient development and peeling operations while maintaining structural integrity.
3Manufacturing precision
If conventional lithography processes are used to manufacture the light blocking structure, then the structure can be formed, but the development and peeling efficiency is poor resulting in low yield
Solution Approach 1:
The conventional lithography-based mechanical fabrication process is replaced with a transfer printing approach. The light blocking structure is formed using printing techniques that enable more efficient development and peeling, thereby improving productivity while maintaining the precision needed for light blocking structure formation.
Data Source
AI summary
A manufacturing method of a micro light emitting diode structure includes: providing a first transfer stamp carrying a plurality of micro light emitting elements; providing a second transfer stamp carrying a plurality of light blocking structures, wherein each of the light blocking structures includes a light blocking layer and a light shielding layer disposed on the light blocking layer; providing a temporary substrate; transferring the micro light emitting elements onto the temporary substrate by the first transfer stamp; and transferring the light blocking structures onto the temporary substrate by the second transfer stamp. The micro light emitting elements and the light blocking structures are arranged alternately and fixed to the temporary substrate by connection layer. A reflectivity of the light blocking layer is greater than a reflectivity of the connection layer, and a Young's modulus of the light blocking layer is greater than a Young's modulus of the connection layer.