Micro LED Light Emitting Substrate With Partitioned Light Shielding

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Solution Overview

Problem

Micro LED light emitting substrates experience light leakage due to morphological deviations and residue from the transfer process, leading to poor shielding performance and reduced yield.

Innovation Solution

A light emitting substrate design featuring a base substrate with a die bonding structure, a light shielding structure, and a flux functional layer, where the shielding material layer and partition structure form a light shielding structure around the light emitting chip, blocking the flux functional layer and preventing light leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If Micro LED is transferred directly to drive backplate using conventional process, then transfer process is simple, but light leakage occurs due to morphological deviation and side light emitting

Engineering Contradiction:

Improvetransfer process simplicityVSAvoidlight leakage

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The invention introduces a partition structure that divides the drive backplate into distinct regions: a light emitting region where Micro LED is mounted and a non-light emitting region surrounded by light shielding structures. This segmentation isolates the light emitting chip from its surroundings, preventing side light emission and light leakage while maintaining a relatively simple transfer process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention introduces a flux functional layer as an intermediary substance between the Micro LED and the drive backplate. This flux layer not only facilitates the transfer and bonding process but also fills morphological deviations and defects, effectively preventing light leakage without complicating the overall transfer procedure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If light shielding structure is added to prevent light leakage, then shielding performance improves, but device complexity increases

Engineering Contradiction:

Improvelight leakage preventionVSAvoidsubstrate structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The invention merges multiple functions into the light shielding structure: it serves as both a light shielding barrier and a structural support element of the drive backplate. The light shielding structure is integrated with the partition structure, combining light emission control and region definition into a single unified component, thereby improving shielding performance without proportionally increasing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The partition structure serves multiple purposes: it defines the light emitting region, provides structural support, and works in conjunction with the light shielding structure to prevent light leakage. This multi-functionality reduces the need for separate components, maintaining structural simplicity while achieving effective light leakage prevention.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If flux functional layer is applied to cover die bonding structure, then bonding quality improves, but light leakage path increases due to residue

Engineering Contradiction:

Improvebonding qualityVSAvoidlight leakage from residue

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The invention extracts and removes the excess flux functional layer beyond the light emitting region through the light shielding structure. By taking out the harmful residue that causes light leakage while retaining the beneficial flux layer for bonding, the invention achieves both high bonding quality and effective light leakage prevention.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention converts the potential harm of flux residue into a benefit by using the flux functional layer to fill morphological deviations and defects in the bonding interface, improving bonding quality. The light shielding structure then confines the flux layer to the light emitting region, transforming what would be harmful residue into a beneficial bonding agent that is strategically positioned.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS20240222570A1Light Emitting Substrate, Preparation Method Therefor, and Display Device

Publication Date: 2024.07.04 BOE TECHNOLOGY GROUP CO LTD

AI summary

A light emitting substrate, a preparation method therefor, and a display device are provided. The light emitting substrate includes a base substrate, a die bonding structure, a light shielding structure and a light emitting chip disposed on the base substrate, wherein the light emitting chip is disposed at a side of the die bonding structure away from the base substrate, the light shielding structure is located at a peripheral side of the light emitting chip, the light emitting substrate further comprises a flux functional layer covering the side of the die bonding structure away from the base substrate, the light shielding structure comprises a shielding material layer and a partition structure, and the flux functional layer is blocked at the partition structure.