Micro-LED Chip Array Transfer via Magnetic Picking
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Solution Overview
Problem
The challenge lies in efficiently picking up and placing micro-LED chips on a substrate for monolithic micro-displays, as their small size and different lattice constants complicate epitaxial growth and wavelength conversion, leading to issues with brightness and display quality.
Innovation Solution
A picking-up and placing process involving the formation of electronic devices in an array on a carrier with conductive layers, supported by a material layer, and then transferred to a target substrate using a magnetic or vacuum force, with an alloy layer formed between the device and substrate for bonding, ensuring efficient placement and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chips are formed on different substrates to achieve better epitaxial quality and luminous efficiency, then brightness and display quality are improved, but the picking-up and placement process becomes more complex and time-consuming
Solution Approach 1:
The patent divides the LED chip array into multiple groups based on color emission characteristics. Each group is picked up and placed on specific regions of the substrate simultaneously, rather than handling individual chips sequentially. This segmentation approach maintains the benefits of separate substrate formation while significantly reducing process complexity and time.
Solution Approach 2:
The patent combines multiple LED chips into array structures that are handled as single units during the picking-up and placement process. By merging individual chip handling into collective array manipulation, the process complexity is reduced while still achieving the desired separation of epitaxial growth substrates for optimal luminous efficiency.
2Manufacturing precision
If LED chips are miniaturized to improve display resolution, then display quality is enhanced, but the picking-up and placement becomes more difficult and less efficient
Solution Approach 1:
The patent merges multiple miniaturized LED chips into array structures that are manipulated as single units. This approach maintains high display resolution through chip miniaturization while dramatically improving productivity by handling arrays rather than individual microminiaturized chips, which would be extremely difficult to manipulate efficiently.
Solution Approach 2:
The patent introduces temporary carrier substrates as intermediaries that hold the miniaturized LED chip arrays during fabrication and transfer. These carriers provide mechanical support and handling interfaces that make it feasible to manipulate and transfer arrays of microminiaturized chips efficiently, overcoming the handling difficulties inherent in direct manipulation of such small components.
3Adaptability or versatility
If wavelength conversion materials are coated to achieve different colored lights, then color variety is improved, but conversion efficiency decreases and uniformity becomes difficult to achieve
Solution Approach 1:
The patent segments the color generation approach by using separate LED chips for different base colors (e.g., blue, green, red) rather than relying on wavelength conversion materials to generate all colors from a single source. This eliminates the energy loss and uniformity issues associated with wavelength conversion while maintaining full color variety through direct emission from optimized LED chips for each color.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process allows for quick and efficient placement of micro-LED chips on a substrate, enhancing brightness and display quality by avoiding epitaxial growth limitations and improving light collimation.
Implementation Method 1
heating the alloy layer to a temperature between a melting point of the alloy layer and 327 degrees Celsius
Implementation Method 2
selectively picking-up parts of the plurality of electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module
Data Source
AI summary
A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.