Micro LED Matrix Display Extraction External Circuit
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Solution Overview
Problem
Large area passive micro light-emitting diode (LED) displays face challenges in achieving high image quality and resolution due to limitations in substrate utilization and LED chip operation, leading to increased production costs and unsatisfactory image resolution.
Innovation Solution
A large area passive micro light-emitting diode matrix display is designed with a substrate and external circuit component, where micro light-emitting diode matrices are mounted on a double-sided polished sapphire substrate, and an external circuit component is used to electrically bond the matrices, allowing for effective LED chip formation and operation without compromising the substrate area for circuit formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large area passive micro-LED display is fabricated using conventional methods, then the display area is increased, but the image quality and image resolution deteriorate due to substrate area loss for external circuits
Solution Approach 1:
The external circuit component is extracted from the substrate and placed on a separate carrier substrate. This separation allows the entire substrate area to be used for forming LED chips, eliminating the trade-off between display area and image resolution. The external circuits are mounted on the carrier and electrically connected to the LED chips through wire bonding or other connection methods.
2Quantity of substance
If more LED chips are arranged on the substrate, then the pixel number is increased, but the substrate area available for external circuits is reduced
Solution Approach 1:
The external circuit component is extracted from the substrate and integrated into a separate carrier. This allows maximum utilization of the substrate area for LED chip arrangement, thereby increasing the pixel number without compromising the space needed for external circuit connections.
3Area of stationary object
If LED chips are spaced farther apart, then the substrate area for external circuits is sufficient, but the image resolution deteriorates
Solution Approach 1:
By extracting the external circuit component to a separate carrier, LED chips can be arranged with minimal spacing across the entire substrate area, thereby achieving high image resolution while ensuring sufficient area for external circuit connections on the carrier.
4Reliability
If a double-sided polished sapphire substrate is used, then the substrate quality is improved, but some area must be used for forming external circuits, reducing the pixel number
Solution Approach 1:
The external circuit component is extracted from the sapphire substrate and placed on a separate carrier. This allows the high-quality double-sided polished sapphire substrate to be fully utilized for LED chip formation, maximizing the pixel number while maintaining substrate quality.
Data Source
AI summary
A large area passive micro light-emitting diode matrix display includes a plurality of micro light-emitting diode matrices and an external circuit component. Each of the micro light-emitting diode matrices includes a first layer, a plurality of light-emitting layers disposed on the first layer, a plurality of second layers disposed on the light-emitting layers, respectively, a plurality of first inner electrode layers disposed on the second layers, respectively, and a second inner electrode layer which is disposed on the first layer, and which includes a first portion and a second portion having a plurality of through holes to accommodate said light-emitting layers, respectively.