Micro LED Module Layout for Thin Displays With Better Heat Dissipation
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Solution Overview
Problem
Existing micro LED displays face challenges in improving light efficiency, heat dissipation, and thickness reduction.
Innovation Solution
A light emitting module comprising a base plate, light emitting device array substrate, molding member, circuit board, connector, and reinforcement plate, with specific configurations to enhance light emission and heat dissipation, and a display apparatus incorporating these modules with a lens assembly and light guide.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If light emitting devices are used directly to implement images in display apparatus, then thickness of the display apparatus is dramatically reduced, but light efficiency and heat dissipation characteristics need improvement
Solution Approach 1:
The patent introduces a specialized circuit board with thermal management structures and heat dissipation components as an intermediary between the light emitting devices and the housing. This mediator enables effective heat removal and light efficiency optimization without increasing the overall display thickness, resolving the contradiction between thin profile and performance requirements
2Length of stationary object
If light emitting devices are used directly to implement images in display apparatus, then thickness of the display apparatus is dramatically reduced, but heat dissipation characteristics need improvement
Solution Approach 1:
The patent introduces a specialized circuit board with thermal management structures and heat dissipation components as an intermediary between the light emitting devices and the housing. This mediator enables effective heat removal and light efficiency optimization without increasing the overall display thickness, resolving the contradiction between thin profile and performance requirements
Solution Approach 2:
The patent replaces conventional thermal management approaches with integrated thermal management circuits and heat dissipation structures embedded in the circuit board. This substitution enables efficient heat removal from the light emitting devices while maintaining the thin display profile, addressing the heat dissipation challenge without mechanical bulk
3Reliability
If connector and light emitting device array substrate are disposed on different surfaces of circuit board, then electrical connection is achieved, but structural complexity increases
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) by disposing the connector and light emitting device array substrate on different surfaces of the circuit board. This dimensional arrangement enables electrical connection while managing structural complexity through spatial optimization rather than planar expansion
Data Source
Figure 1
Figure 2A~2B
Figure 2C~3
AI summary
A light emitting module according to an embodiment includes: a base plate; a light emitting device array substrate disposed on the base plate, and including a plurality of light emitting devices; a molding member covering the light emitting devices; a circuit board having one end electrically connected to the light emitting device array substrate; a connector electrically connected to an opposite end of the circuit board; and a reinforcement plate disposed under the connector.