Micro LED Light Emitting Module Structure for Heat Dissipation
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Solution Overview
Problem
Existing light emitting modules for micro LED displays face challenges in achieving improved light efficiency and heat dissipation, which are crucial for enhancing display performance and reliability.
Innovation Solution
The proposed light emitting module includes a base plate, a light emitting device array substrate, a molding layer, a circuit board, a connector, and a reinforcement plate, which collectively enhance light efficiency and heat dissipation. The module's design allows for improved thermal management and light transmission, addressing the limitations of previous technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light emitting devices are used directly to implement images in display apparatus, then thickness of the display apparatus is dramatically reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The display apparatus is segmented into multiple functional layers including a base plate, light emitting device array substrate, molding layer, circuit board, and reinforcement plate. This segmentation allows heat to be distributed and dissipated through multiple pathways rather than concentrated in a single thin structure.
Solution Approach 2:
A circuit board is introduced as an intermediary component between the light emitting device array substrate and the reinforcement plate. This circuit board serves as a thermal management interface that facilitates heat transfer from the light emitting devices to the reinforcement plate while maintaining electrical connections.
2Ease of manufacture
If conventional light emitting modules are used, then manufacturing is simpler, but light efficiency and heat dissipation characteristics are insufficient
Solution Approach 1:
The light emitting module employs a composite structure combining multiple materials with different properties: the base plate provides structural support and thermal conduction, the molding layer provides optical management and protection, the circuit board provides electrical connectivity and thermal transfer, and the reinforcement plate enhances mechanical strength and heat dissipation. This composite approach achieves both manufacturing feasibility and superior performance.
3Temperature
If the base plate area is increased to improve heat dissipation, then heat dissipation characteristics are improved, but device area increases
Solution Approach 1:
The base plate is designed with optimized local properties including strategic opening patterns and varying thickness regions. These local modifications enhance heat dissipation efficiency through improved airflow and thermal conduction pathways without requiring a proportional increase in the overall base plate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described light emitting module achieves enhanced light efficiency and improved heat dissipation, leading to better performance and reliability in micro LED displays. This design effectively addresses the challenges of previous technologies, resulting in more efficient and durable display solutions.
Implementation Method 1
Light emitting devices are semiconductor devices that use light emitting diodes which are inorganic light sources
Implementation Method 2
a base plate; a light emitting device array substrate disposed on the base plate... a reinforcement plate disposed under the connector
Data Source
AI summary
A light emitting module according to an embodiment includes: a base plate; a light emitting device array substrate disposed on the base plate, and including a plurality of light emitting devices; a molding layer covering the light emitting devices; a circuit board having one end electrically connected to the light emitting device array substrate; a connector electrically connected to an opposite end of the circuit board; and a reinforcement plate disposed under the connector.