Micro LED Molding Layer With Diffusion and Black Layers for Color Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro LED displays face challenges in maintaining visibility and minimizing luminance loss and color change due to the circuit board on which the light emitting diodes are mounted, requiring techniques to enhance image quality.
Innovation Solution
A light emitting module with a molding layer comprising a light diffusion layer and a black molding layer is manufactured by laminating and thermally curing films on a module substrate, forming a structure that surrounds the unit pixels and includes patterns to minimize light loss and color distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a micro LED is mounted on a circuit board, then the display can be made compact and thin, but luminance loss and color change occur due to the circuit board
Solution Approach 1:
A transparent molding layer is introduced as an intermediary between the micro LED and the circuit board. This molding layer compensates for the luminance loss caused by the circuit board mounting, allowing the display to remain compact while maintaining high luminance output.
Solution Approach 2:
The refractive index of the molding layer is specifically optimized (matching the micro LED's refractive index) to minimize light reflection and maximize light extraction efficiency, thereby compensating for luminance loss without increasing display thickness.
2Volume of moving object
If a micro LED is mounted on a circuit board, then the display can be made compact and thin, but color change occurs due to the circuit board
Solution Approach 1:
The transparent molding layer acts as an optical intermediary that prevents color distortion caused by direct contact between the micro LED and the circuit board, while still enabling compact display design.
Solution Approach 2:
The molding layer is composed of a transparent material with specific optical properties (refractive index matching) that is combined with the circuit board structure, creating a composite system that maintains both compactness and color accuracy.
3Illumination intensity
If a molding layer is added to compensate for luminance loss, then visibility is improved, but device complexity increases
Solution Approach 1:
The transparent molding layer serves multiple functions simultaneously: it compensates for luminance loss, prevents color distortion, protects the micro LED, and provides structural support, thereby improving visibility without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces luminance loss and color change, enhancing visibility and image quality in micro LED displays by diffusing and absorbing light to improve clarity and smoothness of the display surface.
Implementation Method 1
forming a molding layer to surround side surfaces of the plurality of unit pixels by disposing the laminated light diffusion film and the black film on the module substrate
Implementation Method 2
The molding layer includes a light diffusion layer and a black molding layer disposed on the light diffusion layer
Implementation Method 3
Laminating the light diffusion film and the black film may include thermally curing the light diffusion film and the black film at a temperature of about 50° C., respectively
Data Source
AI summary
A method of manufacturing a light emitting module includes mounting a plurality of unit pixels on a module substrate, thermally curing a light diffusion film and a black film, laminating the light diffusion film and the black film, forming a molding layer to surround side surfaces of the plurality of unit pixels by disposing the laminated light diffusion film and the black film on the module substrate, and pressing the light diffusion film and the black film; and cutting and removing edges of the module substrate and the molding layer. The molding layer includes a light diffusion layer and a black molding layer disposed on the light diffusion layer.