Micro-LED Structure With Shared Emission Layer Offset Edges

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Solution Overview

Problem

Current micro-LED structures face inefficiencies due to surface recombination carrier loss when the light emitting layer aligns with the edges of the conductive layers, leading to reduced light emission efficiency.

Innovation Solution

A micro-LED structure design where the light emitting layer extends horizontally away from the edges of the conductive layers, preventing contact and minimizing surface recombination, combined with spacers and isolation structures to enhance performance and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the light emitting layer aligns with the edges of the conductive layers, then the manufacturing process is simpler, but surface recombination carrier loss increases and light emission efficiency decreases

Engineering Contradiction:
Improvealignment simplicityVSAvoidsurface recombination carrier loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent introduces asymmetric spacing between the light emitting layer and the conductive layers. Specifically, the light emitting layer is positioned such that its edges do not align with the edges of the first and second conductive layers, creating a non-symmetric structure that prevents surface recombination while maintaining manufacturing feasibility through controlled offset distances

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent introduces an intermediate spacing structure between the light emitting layer and the conductive layers. This intermediate space acts as a mediator that prevents direct contact between the light emitting layer edges and the conductive layer edges, thereby reducing surface recombination carrier loss while allowing the structure to be manufactured with standard processes

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If the light emitting layer extends away from the conductive layer edges, then light emission efficiency improves, but the device complexity increases

Engineering Contradiction:
Improvelight emission efficiencyVSAvoidlayer alignment complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating different spatial relationships between the light emitting layer and the conductive layers at different locations. The light emitting layer is positioned with specific offset distances from the conductive layer edges in certain regions, while maintaining proper alignment in other regions, thereby locally optimizing light emission efficiency without requiring complex overall device redesign

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves light emission efficiency by reducing surface recombination and enhancing carrier injection efficiency, resulting in improved performance and reliability of the micro-LEDs.

Implementation Method 1

A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS12183850B2Micro-LED structure and micro-LED chip including same
Publication Date: 2024.12.31 JADE BIRD DISPLAY (SHANGHAI) LTD
  • US12183850B2 patent drawing
  • US12183850B2 patent drawing
  • US12183850B2 patent drawing

AI summary

A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs.