Micro LED Package Frame for RGB Pixel Transfer Efficiency

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing technologies face challenges in integrating different micro light-emitting devices onto a wiring substrate without causing damage, while ensuring compactness and improving productivity in the transfer process.

Innovation Solution

A micro light-emitting device package is designed with a package frame supporting red, green, and blue micro light-emitting devices, connected by a common electrode and individual electrode pads, with insulating layers and transparent or metal electrodes for efficient electrical connection and compact mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If three separate micro light-emitting devices are transferred individually onto a wiring substrate, then each device can be precisely positioned, but the transfer process becomes complex and productivity decreases

Engineering Contradiction:
Improvetransfer process efficiencyVSAvoidtransfer process complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges three separate micro light-emitting devices (red, green, and blue) onto a single package frame, enabling them to be transferred together as one unit. This combining approach allows three devices to be mounted simultaneously on a wiring substrate, significantly improving transfer process efficiency and productivity while reducing the complexity of performing three separate transfer operations.

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If three micro light-emitting devices are mounted separately on the wiring substrate, then each device can be independently positioned, but the mounting structure becomes larger and less compact

Engineering Contradiction:
Improvemounting efficiencyVSAvoidmounting structure area
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent combines three micro light-emitting devices onto a single package frame with integrated electrode connections. This merging allows the three devices to be mounted together as one compact unit on the wiring substrate, improving mounting efficiency while minimizing the total area occupied compared to mounting three separate devices independently.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If a common electrode structure is used to connect all micro light-emitting devices, then the number of electrode pads is reduced and compactness is improved, but the electrical connection complexity increases

Engineering Contradiction:
Improvepackage areaVSAvoidelectrical connection complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent implements a common electrode structure that serves multiple functions: it provides electrical connection to all three micro light-emitting devices (red, green, and blue) simultaneously, acts as a shared reference potential, and reduces the total number of electrode pads required. This multi-functional common electrode simplifies the overall electrical connection architecture while maintaining compact package dimensions.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of operation

If individual electrode pads extend through the entire package frame for each device, then electrical connection is simplified, but the package frame height and overall device size increase

Engineering Contradiction:
Improveelectrical connection easeVSAvoidpackage frame height
Core Design Contradiction:
Ease of operationVSLength of stationary object

Solution Approach 1:

The patent transitions from a traditional vertical through-substrate electrode configuration to a lateral electrode arrangement where individual electrode pads extend only partially through the package frame and connect to the common electrode through lateral pathways. This dimensional reconfiguration reduces the package frame height while maintaining effective electrical connections among all components.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250380552A1Micro light-emitting device package
Publication Date: 2025.12.11 LC SQUARE CO LTD
  • US20250380552A1 patent drawing
  • US20250380552A1 patent drawing
  • US20250380552A1 patent drawing

AI summary

Provided is a micro light-emitting device package including a package frame including a first main surface and a second main surface extending parallel to each other, a red micro light-emitting device, a green micro light-emitting device, and a blue micro light-emitting device provided on the package frame, a common electrode pad extending from the first main surface to the second main surface of the package frame, individual electrode pads each extending from at least a portion of a lower part of each of the red micro light-emitting device, the green micro light-emitting device, and the blue micro light-emitting device through the package frame, at least one insulating layer extending along a side surface of each of the red micro light-emitting device, the green micro light-emitting device, and the blue micro light-emitting device, and a common electrode provided on top of the package frame and configured to electrically connect each of the red micro light-emitting device, the green micro light-emitting device, and the blue micro light-emitting device to the common electrode pad.