Micro LED Package Sealing to Prevent Reflective Ghost Images
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional micro LED panel package structures suffer from light reflection issues, causing a virtual incomplete image around the objective image due to light emitted from the image display area being reflected back to the non-functional area and then reflected outward, which degrades image quality.
Innovation Solution
A micro package structure is introduced, featuring a micro LED panel with a top cover plane and a seal structure between the micro LED panel and the top cover plane, which prevents light from escaping through gaps and includes a light absorption material to further absorb emitted light, improving image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional package structure with cover plane adhesive is used, then the micro LED panel can be assembled, but light is reflected by the non-functional area metal materials toward the outside, producing a virtual incomplete image that decreases image quality
Solution Approach 1:
The patent extracts and removes the harmful reflective metal materials (signal metal pads and dummy metal) from the non-functional area, or replaces them with non-reflective materials. This eliminates the source of light reflection that causes the virtual incomplete image, while preserving the essential packaging structure and assembly process.
Solution Approach 2:
The patent converts the harmful light reflection effect into a beneficial outcome by introducing light absorption materials in the non-functional area. These materials absorb the light that would otherwise be reflected, transforming the problematic light path into a controlled absorption process that eliminates the virtual image artifact while maintaining package functionality.
2Device complexity
If light is allowed to transmit freely in the package structure, then the structure remains simple, but light escapes through gaps between the cover plane and micro LED panel, degrading image quality
Solution Approach 1:
The patent introduces a seal structure as an intermediary element between the cover plane and the micro LED panel. This seal structure fills and seals the gaps between these components, preventing light from escaping through the gaps. The seal structure acts as a mediator that maintains the optical integrity of the package without requiring complete elimination of manufacturing tolerances or gap variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces light reflection, enhancing image quality by ensuring that light is directed upward and absorbed, thereby minimizing the formation of a virtual incomplete image around the objective image.
Implementation Method 1
A part of light emitted from the image display area will be reflected back to the micro LED panel and to the non-functional area, and then the metal materials will reflect the light again toward the outside
Implementation Method 2
includes a light absorption material to further absorb emitted light, improving image quality
Data Source
AI summary
A micro package structure includes a micro LED panel including an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and a seal structure formed between an edge of the micro LED panel and an edge of the top cover plane around the micro LED array area.