Micro-LED Packaging Structure for High-Yield Mass Transfer
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Solution Overview
Problem
The scaling down of semiconductor elements, such as micro-LEDs, leads to complex thermal bonding processes and high costs, resulting in poor yield and manufacturing challenges in semiconductor structures.
Innovation Solution
A semiconductor structure is formed through a mass transfer process, coplanar process, and redistribution process, involving packaging structures with micro-LED chips, redistribution layers, and conductive pieces, to facilitate efficient transfer and connection to a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor elements are scaled down to increase the number of elements in a semiconductor structure, then the quantity of semiconductor elements increases, but the manufacturing complexity and cost increase dramatically
Solution Approach 1:
The patent divides the semiconductor structure into multiple packaging structures, each containing a subset of micro-LED chips. This segmentation allows the manufacturing process to handle smaller groups of elements separately, reducing the complexity of transferring and connecting each individual element while still achieving a high total quantity of semiconductor elements in the final structure.
Solution Approach 2:
The patent combines multiple micro-LED chips into integrated packaging structures that are transferred and connected as unified units. By merging individual chips into pre-assembled packaging modules, the manufacturing process simplifies the transfer operation from handling numerous separate elements to handling fewer integrated units, thereby reducing process complexity while maintaining high element quantity.
2Reliability
If traditional thermal bonding processes are used for scaled-down semiconductor elements, then electrical connections can be established, but the manufacturing cost increases and yield decreases
Solution Approach 1:
The patent introduces a substrate as an intermediary component that receives multiple packaging structures through simplified connection processes. Instead of directly bonding each micro-LED chip to the final substrate using complex thermal bonding, the packaging structures serve as intermediate units that can be connected more easily, thereby reducing manufacturing cost and improving yield while still achieving reliable electrical connections through the conductive pieces within each packaging structure.
3Quantity of substance
If the number of semiconductor elements increases in a scaled-down structure, then the functional capability improves, but the manufacturing yield deteriorates
Solution Approach 1:
By segmenting the large-scale semiconductor structure into multiple smaller packaging structures, the patent reduces the risk of manufacturing defects affecting the entire structure. If a defect occurs during transfer or connection, it is isolated to a single packaging structure rather than propagating through all elements, thereby maintaining high manufacturing yield even as the total number of micro-LED chips increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, improves yield, and reduces costs by ensuring reliable electrical connections and enhanced light transmission, enhancing the display effect of the semiconductor structure.
Implementation Method 1
a light-transmitting layer, a plurality of micro light-emitting diode (micro-LED) chips... the light-emitting surfaces of the micro-LED chips face the light-transmitting layer
Data Source
AI summary
A semiconductor structure includes packaging structures and a substrate. Each packaging structure includes a light-transmitting layer, micro-LED chips, a first insulating layer, redistribution layers, a second insulating layer, and conductive pieces. The micro-LED chips are on the light-transmitting layer and include an electrode surface and a light-emitting surface facing the light-transmitting layer. The first insulating layer is disposed on the light-transmitting layer and surrounds the micro-LED chips. The redistribution layers are disposed on the first insulating layer and pass through the first insulating layer to be electrically connected to the electrode surfaces. The second insulating layer is disposed on the first insulating layer. The conductive pieces are disposed on the second insulating layer, pass through the second insulating layer to be electrically connected to the redistribution layers, and are between the substrate and the micro-LED chips.