Micro LED Display Pad Embedding for Transfer Efficiency
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Solution Overview
Problem
The commercialization of micro LED displays is hindered by integration and packaging issues due to the small size of micro LEDs, particularly the burdensome task of transferring micro LED dies to a destination substrate and establishing effective electrical connections.
Innovation Solution
A display device structure that includes metal lines and pads on a substrate with connecting posts embedded in the pads, allowing for secure electrical connection and reduced transfer time by integrating electronic devices like micro LEDs onto an intermediate substrate before transferring to a destination array substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro LED dies are transferred to destination substrate using current manufacturing methods, then micro LED displays can be produced, but the transfer process becomes burdensome and inefficient due to the small size of micro LED dies
Solution Approach 1:
The patent implements a multi-layer nested structure where micro LED dies are mounted on an intermediate substrate, which is then mounted on the destination substrate. This nesting approach allows small micro LED dies to be handled and transferred as a larger integrated unit, significantly improving transfer efficiency and reducing operational difficulty.
Solution Approach 2:
The patent introduces an intermediate substrate as a mediator between the micro LED dies and the destination substrate. This intermediate substrate serves as a temporary mounting platform that facilitates the transfer process by providing a larger handling area and enabling batch transfer of multiple micro LED dies simultaneously.
2Reliability
If micro LED dies are transferred to destination substrate, then display device can be assembled, but establishing effective electrical connections becomes problematic due to the small size and precision requirements
Solution Approach 1:
The patent employs nested mounting structures where connection elements are integrated into the intermediate substrate and destination substrate layers. This nested configuration ensures precise alignment and reliable electrical connections by providing multiple levels of mechanical and electrical interfacing between the micro LED dies and the final display device.
Data Source
AI summary
A display device is provided. The display device includes a substrate and a first metal line and a second metal line disposed on the substrate. The display device includes a first pad and a second pad disposed on the substrate and electrically connected to the first metal line and the second metal line respectively. The display device further includes an electronic device disposed on the first pad and the second pad. The electronic device includes a first connecting post and a second connecting post, wherein a distance between the first connecting post and the second connecting post is in a range from 1 um to 200 um. A portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad.