Micro LED Substrate Pad Layout for Replaceable Electrical Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro LED displays face integration and packaging issues due to the small size of micro LEDs, leading to frequent disconnection and difficulty in maintaining electrical connections between the micro LEDs and the destination substrate.
Innovation Solution
Incorporation of redundant pads on the substrate, which serve as spare connections to maintain or repair electrical interconnections between the micro LEDs and the destination substrate, allowing for the replacement of dysfunctional micro LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micro LED dies are mounted on the array substrate using current manufacturing methods, then the display device can be assembled, but the electrical connection between the micro LED and the destination substrate is unstable and prone to disconnection
Solution Approach 1:
The patent applies preliminary action by pre-forming redundant pads on the array substrate before mounting the micro LED dies. These redundant pads are prepared in advance as backup connection points, allowing for potential reconnection if the primary electrical connection fails, thereby improving reliability while maintaining ease of manufacture.
Solution Approach 2:
The patent changes the structural parameter of the electrical connection system by introducing multiple pads (primary and redundant) instead of a single connection point. This parameter change from single-point to multi-point connection improves the stability and reliability of the electrical connection between micro LED dies and the array substrate.
2Ease of repair
If redundant pads are incorporated on the substrate, then the electrical interconnections can be maintained or repaired, but the device structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the electrical connection function into multiple independent pads (first pad and second pad) on the array substrate. This segmentation allows the connection system to be divided into primary and redundant components, enabling localized repair or replacement of failed connections without affecting the entire device structure.
Solution Approach 2:
The redundant pads act as intermediary connection points that can mediate between the micro LED dies and the array substrate when the primary connection fails. These intermediary pads provide alternative pathways for electrical connection, facilitating repairability while adding minimal structural complexity.
3Reliability
If the first electronic component is removed when dysfunctional, then the defective component can be replaced, but the manufacturing process becomes more time-consuming
Solution Approach 1:
The patent applies preliminary action by pre-configuring redundant pads and alternative connection paths during the manufacturing process. When a component becomes dysfunctional, the replacement process is accelerated because the alternative connections are already prepared, reducing the time required for troubleshooting and replacement compared to systems without pre-configured redundancies.
Data Source
AI summary
A manufacturing method of an electronic device is provided. The method includes providing a substrate, providing a plurality of signal lines on the substrate, providing a first pad on the substrate, providing a second pad on the substrate, and providing a first electronic component. The first electronic component includes a first electrode. One of the plurality of signal lines is connected to the first pad, and the first electrode of the first electronic component is connected to the first pad. The method further includes removing the first electronic component from the substrate when the first electronic component is dysfunctional, and providing a second electronic component on the substrate and connected to the second pad.