Micro LED Pad Structure With Redundant Pads for Connection Repair
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Solution Overview
Problem
The integration and packaging of micro LEDs in display devices face challenges due to the small size of the micro LED dies, leading to issues with electrical connection maintenance and repair between the micro LED and the destination substrate, such as easy detachment and dysfunctional connections.
Innovation Solution
The design incorporates a substrate with both main and redundant pads for electrical connection, where the redundant pads serve as spare connections in case the main pads become dysfunctional or damaged, allowing for effective repair and replacement of the electrical connection between the micro LED and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If micro LED dies are used due to their small size for high resolution displays, then display quality is improved, but electrical connection reliability deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-configuring redundant pads alongside main pads during the manufacturing process. These redundant pads are prepared in advance but not initially connected to functional micro LEDs, ready to be activated if connection failures occur later, thus preventing future reliability issues
Solution Approach 2:
The patent changes the electrical connection configuration by selectively connecting or disconnecting signal lines to different pads (main or redundant) based on the operational status of micro LEDs. This dynamic parameter change allows the system to adapt to connection failures and maintain reliability
2Ease of repair
If redundant pads are added to enable repair of electrical connections, then ease of repair is improved, but device complexity increases
Solution Approach 1:
The patent segments the electrical connection system into multiple independent pad units (main pads and redundant pads), each capable of serving as a separate connection point. This segmentation allows selective repair of individual connections without affecting the entire display system
Solution Approach 2:
The redundant pads are designed with universal functionality to replace main pads when needed. Both main and redundant pads share the same structural design and electrical connection capabilities, allowing the redundant pads to universally substitute for failed main pad connections
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a plurality of signal lines and a plurality of units. The signal lines are disposed on the substrate. The units are disposed on the substrate. At least one of the units includes a first main pad, a first redundant pad, and an electronic component including a first electrode. In addition, one of the signal lines is electrically connected to the first electrode of the electronic component, the first main pad and the first redundant pad.