Flexible Micro LED Display Panel for Seamless Narrow-Bezel Splicing
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Solution Overview
Problem
Existing display technologies, such as GOA and COF, struggle to achieve seamless splicing of display screen bezels, leading to limitations in narrowing bezels for full-screen displays in mobile devices.
Innovation Solution
A display panel design featuring a flexible substrate with connection-via pairs, connection portions, a leveling layer, driving circuits, a driving chip, and micro LEDs, which allows for seamless splicing by using a sacrificial layer and a polyimide flexible substrate to manage thermal expansion and prevent metal fracturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If GOA or COF technology is used to bond on display screen bezel, then bezel width is reduced, but seamless splicing cannot be achieved
Solution Approach 1:
The patent introduces a flexible substrate as an intermediary carrier between the rigid base plate and the display components. This flexible substrate enables seamless splicing by allowing precise alignment and connection of multiple display panels, while the rigid base plate provides structural support during manufacturing. The intermediary flexible substrate resolves the contradiction by enabling both narrow bezel design and seamless splicing capability.
Solution Approach 2:
The patent divides the display system into separate modular components (multiple display panels) that can be independently manufactured and then spliced together using the flexible substrate. This segmentation allows each panel to be optimized separately while achieving seamless integration through the flexible carrier, thereby enabling both narrow bezels and seamless splicing.
2Reliability
If metal connection structures are used in flexible substrate, then electrical connection is achieved, but metal fracturing occurs due to thermal expansion
Solution Approach 1:
The patent changes the physical parameters of the connection structure by using connection portions with controlled thickness (less than via depth) and introducing a leveling layer. This parameter modification allows the metal connection structures to accommodate thermal expansion without fracturing, while maintaining reliable electrical connection between the rigid base plate and flexible substrate.
Solution Approach 2:
The patent employs a composite structure combining rigid base plate, flexible substrate, connection portions, and leveling layer. This composite material system allows different components to handle thermal stress differently - the rigid base plate provides stable electrical connection while the flexible substrate and leveling layer accommodate thermal expansion, preventing metal wire fracturing.
3Reliability
If connection portions fill entire connection via, then electrical connection is improved, but thermal expansion causes metal fracturing
Solution Approach 1:
The patent modifies the connection portion parameters by setting its thickness to be less than the via depth, creating a controlled void space. This parameter change allows the connection portion to maintain good electrical connection while providing expansion room to accommodate thermal expansion, thereby preventing metal fracturing.
Solution Approach 2:
The patent applies different properties to different parts of the connection structure: the connection portion has optimized thickness for electrical connection, while the surrounding via structure and leveling layer provide thermal expansion accommodation. This local quality differentiation resolves the contradiction between electrical connection quality and thermal expansion resistance.
Data Source
AI summary
A display panel, a manufacturing method thereof, and a display device. The manufacturing method comprises: sequentially forming a sacrificial layer and a flexible substrate on a surface of a side of a rigid base plate; forming a connection-via pair in the flexible substrate; forming a conductive layer on the flexible substrate, and forming connection portions; forming a leveling layer; forming driving circuits corresponding one-to-one to the connection-via pairs on the flexible substrate, and forming a driving chip on a side of the driving circuits facing away from the flexible substrate, the driving chip being electrically connected to the driving circuits; separating the sacrificial layer from the flexible substrate; and forming a micro LED device on a surface of the flexible substrate facing away from the driving circuits, the micro LED device being electrically connected to the connection portions.