Dual-Platform Micro LED Mass Transfer for Parallel Alignment
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Solution Overview
Problem
Conventional methods for mass-producing micro LEDs face challenges in transferring millions of micro LEDs from a substrate to a display due to inconsistent distances between LEDs on wafers and substrates, and inefficient replacing and aligning processes that decrease overall efficiency.
Innovation Solution
A dual-platform system with picking and placing units allows simultaneous execution of mass transferring, replacing, and aligning processes, using excimer laser to penetrate through a hollow area for efficient chip transfer between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mass transferring methods (electrostatic adhesion, van der Waals force, electromagnetic absorption) are used, then micro LEDs can be transferred to substrate, but the distances between micro LEDs on wafers and substrates remain inconsistent
Solution Approach 1:
The patent replaces mechanical transfer methods (electrostatic adhesion, van der Waals force, electromagnetic absorption) with a laser-based ablation system. The excimer laser precisely ablates micro LEDs from the wafer and transfers them to the substrate, enabling consistent positioning while maintaining high transfer efficiency. The laser system provides both the precision needed for consistent spacing and the speed required for mass production.
2Productivity
If patterning laser ablation method is used, then high-precision optical array and high transfer efficiency are achieved, but the replacing process and aligning process for substrates become time-consuming bottlenecks
Solution Approach 1:
The patent implements preliminary action by pre-positioning multiple substrates in a queue system before the transfer process begins. As one substrate is being processed, the next substrate is already aligned and ready in the queue. This eliminates the time-consuming sequence of completing transfer then replacing/aligning substrates, as substrate replacement and alignment occur in parallel with ongoing transfer operations.
Solution Approach 2:
The patent ensures continuity of useful action by implementing a continuous substrate queue system where substrate replacement and alignment operations occur continuously in parallel with the laser transfer process. Instead of stopping transfer to replace substrates, the system maintains uninterrupted transfer operations while substrates are continuously cycled through alignment and replacement, eliminating idle time and maintaining constant productivity.
3Manufacturing precision
If substrate replacing and aligning processes are performed sequentially after mass transfer, then positioning accuracy is achieved, but overall transferring efficiency decreases significantly
Solution Approach 1:
The patent applies dynamics by making the substrate handling system dynamic and adaptive. Multiple substrates are positioned at different stages in the queue, with alignment and replacement operations occurring at different times for different substrates. This dynamic parallel processing allows the system to maintain high precision alignment while simultaneously improving overall efficiency through continuous operation, rather than rigid sequential processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly increases mass transferring efficiency by 90%, reducing the time for replacing and aligning processes, and achieves precise chip transfer with improved throughput.
Implementation Method 1
emitting a laser to the first substrate moving to the hollow area so as to mass-transfer the chips to the second substrates on the working area
Data Source
AI summary
A mass transferring system and the method thereof are provided. The system includes two platforms and a plurality of picking and placing units. When the mass transferring process is performed for one of the substrates, the replacing process and the aligning process are simultaneously executed for another one of the substrates, such that the mass transferring process and the replacing process can be performed at the same time. Compared with the conventional mass transferring processes, the efficiency of the mass transferring system and the method thereof according to the present invention can be increased by 90%.