Substrate-Free Micro LED Chip with Perimeter Electrical Connections
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Solution Overview
Problem
Conventional LED package devices have size and thickness limitations due to the use of substrates, which restrict their application in wearable devices and high-density displays with fine pitch requirements.
Innovation Solution
A light-emitting device utilizing micro LED chips without substrates, with electrical connecting layers extending to the perimeter of the light exit surface and a housing layer that encloses the chip and connecting layers, allowing for reduced size and thickness, and a package device design that integrates these micro LED chips with a circuit board and protecting layer for enhanced connectivity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional LED package devices use substrates with certain thickness, then structural stability is maintained, but the overall size and thickness cannot be reduced
Solution Approach 1:
The patent removes the substrate from the conventional LED package structure, extracting the component that prevents thickness reduction. The micro LED chip is suspended without a substrate, with electrical connecting layers providing support and connectivity, enabling ultra-thin profiles while maintaining structural integrity through alternative support mechanisms
Solution Approach 2:
The patent transitions from a planar substrate-based structure to a three-dimensional suspended structure where the micro LED chip is positioned between upper and lower supporting layers. This dimensional reorganization allows the chip to be supported from both sides without requiring a thick substrate, reducing overall thickness while maintaining stability
2Volume of moving object
If micro LED chips without substrates are used, then size and thickness are reduced, but electrical connectivity and structural support become more challenging
Solution Approach 1:
The electrical connecting layers serve multiple functions simultaneously: they provide electrical connectivity between the micro LED chip electrodes and external circuits, provide mechanical support for the suspended chip, and extend along the sidewalls to provide structural stability. This multi-functionality reduces the need for separate components, simplifying the overall structure despite the absence of a substrate
Solution Approach 2:
The electrical connecting layers are nested within the housing structure, with the micro LED chip positioned between the upper and lower supporting layers. The connecting layers extend into the housing cavity, creating a nested arrangement where the chip is embedded within the supporting structure, optimizing space utilization and reducing overall device size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the reduction of overall size and thickness of light-emitting devices, facilitating their use in compact applications such as wearable devices and high-density displays while maintaining efficient electrical connectivity and light emission.
Implementation Method 1
a micro light-emitting diode chip (micro LED chip) includes a light exit surface, a bottom surface opposite to the light exit surface and a first electrode and a second electrode located on the bottom surface
Data Source
AI summary
A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.