Micro LED Transfer Substrate Using Phase-Change Grooves

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Solution Overview

Problem

Existing display technologies face inefficiencies and high costs in the massive transfer of Micro LEDs due to complex and low-efficiency transfer processes.

Innovation Solution

A transfer substrate with phase change materials in accommodating grooves, allowing for the simultaneous transfer of multiple types of Micro LEDs by controlling phase changes to facilitate efficient placement, utilizing a base substrate with a blocking layer and pixel driving circuits for precise temperature control and signal provision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If one-by-one transfer method is used for Micro LEDs, then transfer precision can be maintained, but transfer efficiency is low and transfer period is long

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidtransfer period
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The transfer substrate is divided into multiple object setting regions (first type, second type, third type) that can be independently controlled. Each region contains accommodating grooves for specific Micro LED types, allowing parallel processing of different Micro LED colors simultaneously, thus improving transfer efficiency while maintaining precision through localized control.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Phase change materials are introduced into the accommodating grooves, which change from solid to liquid state upon heating. This parameter change enables automatic release of Micro LEDs from the transfer substrate to the array substrate when heated, allowing rapid simultaneous transfer of multiple Micro LED types without complex mechanical operations, thereby reducing transfer period and improving efficiency.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If multiple types of Micro LEDs are transferred simultaneously, then transfer efficiency is improved, but process complexity increases

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidprocess complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The transfer substrate is designed with multi-functionality by incorporating multiple types of object setting regions with different phase change materials in a single device. Each region can handle different Micro LED types (red, green, blue) simultaneously, eliminating the need for multiple separate transfer processes and reducing overall process complexity while improving efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Different phase change materials with distinct phase change temperatures are used in different object setting regions. This allows selective heating control where only specific regions undergo phase transition at given temperatures, enabling simplified control of complex multi-type Micro LED transfers through temperature-based selective activation of regions.

Inventive Principle:
Principle #36Phase transitions

3Productivity

If phase change materials are used in all object setting regions, then simultaneous transfer capability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvesimultaneous transfer capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

Phase change materials are selectively applied only to specific object setting regions that require simultaneous transfer capability, rather than uniformly to all regions. This local quality approach reduces material costs and simplifies manufacturing processes while maintaining the necessary simultaneous transfer capability for multiple Micro LED types where needed.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Different phase change materials with varying phase change temperatures are selected for different object setting regions based on their specific transfer requirements. This parameter differentiation allows optimization of material selection and quantity, reducing overall manufacturing cost while achieving the desired simultaneous transfer capability for multiple Micro LED colors.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method significantly enhances transfer efficiency and reduces the transfer period by enabling the simultaneous placement of multiple Micro LEDs with different colors, improving the overall yield and simplifying the process.

Implementation Method 1

phase change materials in accommodating grooves of light-emitting element setting regions with the same waveband are controlled to be subjected to phase change

Methodology Applied
Scientific EffectPhase change: Phase Change

Data Source

PatentUS12125736B2Display panel and transfer method
Publication Date: 2024.10.22 SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
  • US12125736B2 patent drawing
  • US12125736B2 patent drawing
  • US12125736B2 patent drawing

AI summary

Provided are a display panel and a transfer method. The display panel includes: an array substrate, where the array substrate includes a base substrate, and the base substrate comprises a plurality of sub-pixel setting regions arranged in an array; an insulating layer located on a side of the pixel driving circuit array facing away from the base substrate, where the pixel driving circuit array includes pixel driving circuits arranged in an array; the insulating layer forms accommodating grooves respectively within the plurality of sub-pixel setting regions; and the pixel driving circuits are disposed in one-to-one correspondence with the accommodating grooves; and data lines and heating lines, where each of the data lines is electrically connected to a respective column of pixel driving circuits among a plurality of columns of pixel driving circuits arranged in the array.