Micro-LED Element Pin Asymmetry for Alignment Tolerance

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Solution Overview

Problem

The high alignment precision requirements for micro-LED elements and bonding pads in display devices lead to low yield due to the small size of micro-LED elements and the resulting stringent assembly challenges.

Innovation Solution

The design of micro-LED elements with strip-like element pins and bonding pads with strip-like bonding pins, where the length of the element pin is greater than the width of the bonding pin and a non-zero included angle between their extending directions, allowing for increased alignment tolerance and reducing the risk of misalignment defects during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the micro-LED element size is reduced to achieve high-resolution display, then the display resolution is improved, but the alignment precision requirement increases and yield decreases

Engineering Contradiction:
Improvedisplay resolutionVSAvoidassembly yield
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The bonding pin is designed with asymmetric dimensions where the length in the first direction (alignment direction) is greater than the width in the second direction. This asymmetric geometry creates a larger tolerance window for alignment in the critical first direction, allowing the micro-LED element to be accurately aligned despite size reduction, thereby maintaining high display resolution while improving assembly yield

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The bonding pin structure utilizes dimensional differentiation by making the length in the first direction significantly larger than the width in the second direction. This dimensional change allows the alignment process to be more tolerant in the first direction (length direction) while maintaining precision requirements in the second direction, effectively decoupling the alignment sensitivity from the micro-LED element size reduction

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the alignment precision requirement is increased to maintain welding quality, then the welding quality is improved, but the assembly complexity and difficulty increase

Engineering Contradiction:
Improvewelding qualityVSAvoidassembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The bonding pin employs asymmetric dimensions with length greater than width, creating a geometric feature that guides alignment in the critical first direction. This asymmetric design inherently provides alignment tolerance that maintains welding quality without requiring complex assembly processes or high-precision positioning equipment

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The asymmetric bonding pin structure performs the alignment function preliminarily through its geometric design before the actual welding process. The larger length in the first direction pre-establishes an alignment tolerance window, allowing the micro-LED element to be positioned accurately without requiring complex real-time adjustment mechanisms during assembly

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10223963B2Light-emitting unit and display device
Publication Date: 2019.03.05 SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
  • US10223963B2 patent drawing
  • US10223963B2 patent drawing
  • US10223963B2 patent drawing

AI summary

The present disclosure provides a light-emitting unit and a display device. The light-emitting includes a micro-LED element and a bonding pad. The micro-LED element includes an element pin, the bonding pad includes a bonding pin, in each welding pair of the element pin and the bonding pin, a length of the element pin is greater than a width of the bonding pin, and a non-zero angle is formed between the extending direction of the element pin and the extending direction of the bonding pin. When the element pin is deviated from the bonding pin in a certain range, the element pin can still be aligned accurately with the bonding pin. Thus, a requirement on the alignment precision between the micro-LED element and the bonding pad is lowered in a certain extent, thereby improving the yield.