Micro LED Die Pitch Mixing for Uniform Display Emission

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Solution Overview

Problem

Micro LED technology is still in the development stage, and minor compositional deviations during manufacturing can lead to noticeable deviations in emission wavelength, luminous intensity, or chromaticity, resulting in non-uniform displays.

Innovation Solution

A method involving categorizing LED groups by emission properties and transferring them through multiple stages with specific pitching and mixing patterns to achieve uniform distribution on displays, ensuring consistent light emission across the display.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If LED dies are arranged on conventional displays without mixing, then the manufacturing process is simple, but noticeable deviations in emission wavelength, luminous intensity, or chromaticity result in non-uniform displays

Engineering Contradiction:
Improveuniformity of light emissionVSAvoidcomplexity of processing method
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The method segments LED dies into different categories based on emission characteristics (wavelength, luminous intensity, chromaticity) and processes each category separately through multiple transfer stages, enabling precise control over final spatial distribution to achieve uniform displays

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces a categorical dimension for organizing LED dies beyond simple spatial arrangement. By classifying dies into categories and using multi-stage transfers with different pitch ratios, the system achieves two-dimensional spatial mixing that eliminates non-uniformity while maintaining manufacturing feasibility

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If LED dies with various emission characteristics are mixed, then uniform distribution on display is achieved, but the processing and arrangement complexity increases

Engineering Contradiction:
Improveuniformity of light emissionVSAvoidease of processing LED groups
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

LED dies are pre-categorized into distinct groups based on emission characteristics before the transfer process. This preliminary classification enables systematic handling in subsequent transfer stages, reducing the complexity of real-time sorting while achieving uniform distribution

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention introduces intermediate transfer carriers as mediators between the LED die source and the final display substrate. These carriers facilitate the multi-stage transfer process, enabling complex mixing patterns to be achieved through sequential, manageable steps rather than a single complex operation

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If a single-stage transfer method is used, then the processing time is short, but uniform distribution of LED dies with different emission characteristics cannot be achieved

Engineering Contradiction:
Improveuniformity of light emissionVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The transfer process is divided into periodic stages with alternating functions: the first transfer stage moves LED groups to intermediate carriers, and the second transfer stage moves them to the final substrate. This periodic multi-stage approach achieves uniform distribution while keeping each individual transfer operation relatively simple and fast

Inventive Principle:
Principle #19Periodic action

Data Source

PatentUS20240258455A1Method of processing light-emitting elements, system and device using the same
Publication Date: 2024.08.01 ENNOSTAR CORP
  • US20240258455A1 patent drawing
  • US20240258455A1 patent drawing
  • US20240258455A1 patent drawing

AI summary

A method of processing light-emitting elements includes: placing a plurality of LED dies from original wafers or trays on each trays of a next-stage carrier, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or trays to be placed on two non-adjacent positions in the first direction on the tray of the next-stage carrier. The LED dies on the original wafer or trays have a first horizontal pitch and a first vertical pitch. The LED dies on each tray of the next-stage carrier have a second horizontal pitch and a second vertical pitch. The second horizontal pitch is greater than the first horizontal pitch, or the second vertical pitch is greater than the first vertical pitch. Besides, a light-emitting element device using the aforementioned method is also provided.