Micro LED Pixel Package with Flexible RDL and Wavelength Conversion
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Solution Overview
Problem
Traditional pixel packages are passive, lack independent control, have poor color uniformity, and are not easily bent, leading to issues like large color point shifts and low process yield.
Innovation Solution
An active micro LED pixel package with a flexible redistribution layer, composite laminates, and wavelength conversion layers, allowing independent control and improved luminous efficiency, color uniformity, and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional pixel package structure is used, then manufacturing process is simple, but the pixel package cannot be independently controlled and has poor color uniformity
Solution Approach 1:
The pixel package is divided into independent controllable units with separate control electrodes, allowing each pixel to be independently addressed and controlled. The package structure is segmented into functional layers including substrate, LED chips, light-adjusting layers, and control circuitry, enabling independent operation of each pixel element.
Solution Approach 2:
The patent introduces a vertical layering dimension to achieve independent control. By stacking functional layers (substrate, LED chips, light-adjusting layers, control electrodes) in the vertical dimension, the package gains independent control capability without complicating the horizontal planar structure.
2Adaptability or versatility
If conventional pixel package is used, then structure is simple, but the package is not easily bent and has large color point shift
Solution Approach 1:
The patent employs flexible substrates and thin-film structures throughout the pixel package construction. The substrate is replaced with flexible materials, and thin-film layers are used for LED chips, light-adjusting layers, and encapsulation, enabling the entire package to be easily bent while maintaining structural integrity and color precision.
3Manufacturing precision
If red and green LED chips are used to meet color uniformity requirements, then process yield is reduced, but color uniformity is improved
Solution Approach 1:
The patent changes the fundamental parameter of light generation from direct LED emission to wavelength conversion. Instead of using red and green LED chips with limited yield, the system uses blue or UV LED chips combined with phosphor materials that convert wavelengths to produce red, green, and blue light, dramatically improving process yield while maintaining color uniformity.
Solution Approach 2:
Phosphor materials serve as intermediary substances between the blue/UV LED chips and the final red, green, and blue light output. The phosphors absorb high-energy photons from the LED and re-emit at lower energies corresponding to red and green wavelengths, enabling high-yield production of uniform colors without requiring rare red and green LED chips.
4Loss of energy
If passive pixel package structure is used, then manufacturing is easier, but luminous efficiency is poor and contrast is reduced
Solution Approach 1:
The patent converts potentially harmful stray light and optical losses into beneficial effects. Light-adjusting layers are positioned to capture light that would otherwise be lost, and wavelength conversion layers efficiently transform unused wavelengths into useful visible light, improving luminous efficiency by turning optical 'waste' into useful illumination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables individually controlled pixel packages with high color point concentration, small color shifts, and enhanced process yield, while maintaining flexibility and improved contrast.
Implementation Method 1
the pixel package according to the embodiment of the present disclosure converts the light emitted by the LED chip (e.g., the LED chip that emits ultraviolet light) into light having a specific wavelength through the wavelength conversion layer
Implementation Method 2
the composite laminate between the LEDs may effectively improve the luminous efficiency of the pixel package and improve the contrast
Data Source
AI summary
A method for forming a pixel package is provided. The method for forming the pixel package includes the following steps: providing a first substrate; transferring a first LED chip and a second LED chip to the first substrate; forming a composite laminate between the first LED chip and the second LED chip; adhering a second substrate to a top surface of the composite laminate; removing the first substrate from back sides of the first LED chip, the second LED chip, and the composite laminate; forming a redistribution layer on the back sides of the first LED chip, the second LED chip, and the composite laminate; and removing the second substrate from the top surface of the composite laminate.