Micro LED Display Panel Layout for Easier Pixel Repair
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Solution Overview
Problem
The manufacturing process of micro LED display panels is complicated by the need for additional photolithography and etching to connect side electrodes, increasing the difficulty of the repairing process and reducing the yield.
Innovation Solution
A display panel design incorporating vertical light emitting devices and flip-chip light emitting devices, where the flip-chip devices replace abnormally driven vertical devices with identical colors, simplifying the repair process and enhancing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional photolithography and etching process is used to connect side electrodes, then electrical connection is achieved, but the difficulty of repairing process increases
Solution Approach 1:
The patent divides the light emitting device into two separate electrodes: a first electrode that is wire-bonded to the circuit board, and a second electrode that is flip-chip bonded to the circuit board. This segmentation allows each electrode to be connected through the most suitable method, simplifying the overall structure and improving repairability compared to using a single complex connection method for both electrodes.
Solution Approach 2:
The patent introduces a bonding pad as an intermediary element on the circuit board that facilitates the connection between the light emitting device electrodes and the circuit board. The bonding pad serves as a dedicated interface that simplifies the connection process and enables easier replacement and repair of the light emitting device.
2Reliability
If vertical micro LED is used as light emitting device, then optical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the connection approach for vertical micro LEDs by using wire bonding for one electrode and flip-chip bonding for the other electrode. This segmentation allows the manufacturing process to leverage the advantages of each bonding method while avoiding their individual complexities, thereby simplifying overall manufacturing while maintaining high optical performance.
Solution Approach 2:
The patent employs a universal bonding pad structure on the circuit board that can accommodate both wire-bonded and flip-chip bonded connections. This multi-functional bonding pad design simplifies the manufacturing process by providing a unified interface for different connection types, reducing the overall manufacturing complexity despite using advanced vertical micro LED technology.
3Productivity
If flip-chip light emitting device is used for replacement, then repairing yield is improved, but device integration complexity increases
Solution Approach 1:
The patent designs the circuit board with a universal bonding pad structure that can accommodate both the original wire-bonded vertical micro LED and the replacement flip-chip light emitting device. This multi-functional interface design enables high repairing yield by allowing easy replacement while maintaining consistent integration complexity, as the bonding pad handles both connection types in the same manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the complexity of the repair process and improves the yield by allowing flip-chip devices to replace abnormally driven vertical devices with the same color, ensuring efficient and effective device replacement.
Implementation Method 1
a plurality of vertical light emitting devices... electrically connected to the pixel array substrate... the flip-chip light emitting device is disposed in the second pixel area and electrically connected to the pixel array substrate
Data Source
AI summary
A display panel includes a pixel array substrate, a plurality of vertical light emitting devices and a flip-chip light emitting device. The pixel array substrate has a first pixel area and a second pixel area. The vertical light emitting devices are disposed in the first pixel area and the second pixel area and electrically connected to the pixel array substrate. The flip-chip light emitting device is disposed in the second pixel area and electrically connected to the pixel array substrate. A color of an emitted light beam of the flip-chip light emitting device and a color of an emitted light beam of one of the vertical light emitting devices located in the first pixel area are identical.