Micro-LED Panel Interconnect Layout to Eliminate Slope Line Breaks
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Solution Overview
Problem
Micro-LED display panels face issues with metal lines breaking due to the need to climb a height differential of 30-50 microns, leading to electrical connectivity failures between the driving circuit and upper electrodes.
Innovation Solution
The implementation of conductive blocks and top wires on the substrate and insulating layer, respectively, allows for electrical connection between the driving circuit and upper electrodes without the need for metal lines to climb a slope, using a method that includes transferring micro-LEDs and conductive blocks onto a substrate, forming an insulating layer, and connecting top wires to upper electrodes and conductive blocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal lines are used to connect driving circuit and upper electrodes, then electrical connection is achieved, but metal lines are prone to breaking due to height differential
Solution Approach 1:
The patent transitions from a three-dimensional sloped connection to a two-dimensional planar connection by flattening the micro-LED structure. The micro-LED is embedded in the substrate with its upper end exposed, allowing metal lines to connect horizontally at the same level, eliminating the need to climb vertical slopes and thus preventing line breakage.
Solution Approach 2:
Instead of having the metal line climb up to reach the elevated upper electrode, the patent inverts the approach by embedding the micro-LED into the substrate so that the upper electrode becomes accessible at the substrate surface level, reversing the traditional connection geometry.
2Ease of manufacture
If metal lines climb a slope to reach upper electrodes, then electrical connection is established, but the connection point becomes a weak point prone to breaking
Solution Approach 1:
The patent eliminates the vertical dimension of the connection path by embedding the micro-LED in the substrate, transforming the sloped three-dimensional connection into a horizontal two-dimensional connection at the substrate surface, thereby removing the weak point where metal lines previously had to climb slopes.
3Illumination intensity
If micro-LEDs are mounted on substrate surface, then light emission is achieved, but height differential causes metal line breakage
Solution Approach 1:
Instead of mounting micro-LEDs on top of the substrate surface creating height differential, the patent inverts the mounting approach by embedding the micro-LEDs into the substrate, with only the upper ends exposed, thereby maintaining light emission capability while eliminating the height differential that causes metal line breakage.
Solution Approach 2:
The patent changes the mounting geometry from vertical elevation above substrate to horizontal embedding within substrate, allowing metal lines to access upper electrodes at the same planar level without vertical climbing, thus preventing breakage while preserving illumination function.
Data Source
AI summary
A micro-LED display panel includes a substrate, an insulating layer on the substrate, and a plurality of micro-LEDs on the substrate and embedded in the insulating layer. The micro-LEDs define a display area. Each micro-LED includes a bottom surface coupled to a lower electrode and a top surface exposed from the insulating layer and coupled to the upper electrode. Conductive blocks are set outside the display area, the conductive blocks are electrically coupled to a driving circuit on the substrate. Top wires are set on a surface of the insulating layer away from the substrate and each top wire is electrically coupled to at least one upper electrode and at least one conductive block.