Micro LED Display Module Positioning via Light Shielding Member

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Solution Overview

Problem

Micro LEDs deviate during the bonding process due to pressure applied in the bonding process, leading to unstable electrical and physical connections with the TFT layer in display module manufacturing.

Innovation Solution

A light shielding member is placed on the TFT layer before transferring the micro LEDs, with a mesh structure and openings larger than the LEDs, and an adhesive is applied to connect the LED and TFT electrode pads, ensuring stable bonding by minimizing interference and maintaining precise positioning during heat pressing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive material is used to bond LED chip to TFT substrate, then electrical connection is achieved, but LED chip deviates from transferred position due to pressure applied during bonding

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidLED chip positioning accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming protrusions on the TFT substrate before transferring the LED chip. These protrusions are created in advance to provide mechanical support and positioning features that prevent LED chip deviation during the subsequent bonding process, rather than relying solely on adhesive bonding.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The protrusions act as an intermediary structure between the LED chip and the TFT substrate. Instead of direct adhesive bonding that causes deviation, the protrusions serve as a mechanical intermediary that maintains precise positioning while allowing electrical connection through the adhesive material applied to these protrusions.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If pressure is applied during bonding process to ensure adhesive bonding, then physical connection is achieved, but LED chip position deviates

Engineering Contradiction:

Improvebonding strengthVSAvoidLED chip positioning accuracy

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The protrusions are pre-formed on the TFT substrate before the bonding process to provide a mechanical framework that maintains LED chip positioning. This preliminary structural preparation allows subsequent pressure application during bonding without causing position deviation, as the protrusions physically constrain the LED chip during pressing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the physical parameter of the substrate surface by creating three-dimensional protrusions instead of a flat surface. This structural parameter change provides mechanical support that maintains positioning accuracy even when pressure is applied during bonding, separating the functions of positioning and bonding strength.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11715729B2Display module and method of manufacturing the same

Publication Date: 2023.08.01 SAMSUNG ELECTRONICS CO LTD

AI summary

A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.