Micro LED Protruding Structure Prevents Electrode Short Circuits
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Solution Overview
Problem
The miniaturization of micro light emitting diodes (micro-LEDs) leads to a shortening of electrode pad spacing, increasing the likelihood of short circuits during the bonding process due to overflowing conductive soldering materials, resulting in defective products and reduced production yields.
Innovation Solution
Incorporating a protruding structure between the first and second electrodes of the micro light emitting device, where the protruding structure is strategically positioned to prevent the bonding pads from making contact with each other, thereby controlling the overflow of soldering materials and ensuring proper bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the LED is miniaturized to reduce size, then the device size is reduced, but the spacing between electrode pads is shortened increasing short circuit risk
Solution Approach 1:
A protruding structure is introduced as an intermediary element between the first and second electrode pads. This protruding structure physically separates the bonding pads, preventing conductive soldering materials from making contact between electrodes during the bonding process, thereby eliminating short circuit risks while maintaining miniaturization benefits
2Volume of moving object
If the spacing between electrode pads is reduced for miniaturization, then the device size is reduced, but the production yield is decreased due to increased defective products
Solution Approach 1:
The protruding structure serves as a protective intermediary that prevents bonding pad contact and short circuits during assembly. By eliminating the primary cause of defective products, this structure significantly improves production yield while allowing continued miniaturization of the device
3Volume of moving object
If the spacing between electrode pads is shortened, then the device size is reduced, but the design margin is reduced increasing short circuit likelihood
Solution Approach 1:
The protruding structure compensates for the reduced design margin by providing a physical barrier that prevents bonding pad contact. This intermediary element allows the electrode pads to be positioned closer together while maintaining adequate separation during bonding, effectively restoring the design margin despite miniaturization
Data Source
AI summary
A micro light emitting device including a component layer, a first electrode and a second electrode is provided. The component layer includes a main body and a protruding structure disposed on the main body. The first electrode is electrically connected to the component layer. The second electrode is electrically connected to the component layer. The first electrode, the second electrode and the protruding structure are disposed on the same side of the main body. The protruding structure is located between the first electrode and the second electrode. A connection between the first electrode and the second electrode traverses the protruding structure. The main body has a surface. The protruding structure has a first height with respect to the surface. Any one of the first electrode and the second electrode has a second height with respect to the surface. The relation 0.8≤H1/H2≤1.2 is satisfied, wherein H1 is the first height and H2 is the second height. A display apparatus having a plurality of micro light emitting devices is provided as well.