Micro LED Module Protrusion Layout to Prevent Electrode Shorting
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Solution Overview
Problem
In micro LED displays, precise control of conductive paste or solder paste is challenging due to the small size of micro LED chips, leading to potential short circuits and defects in the mounting process.
Innovation Solution
The use of insulative protrusions with specific heights and electrode arrangements on an insulating surface, where LED chips are mounted, prevents short circuits by creating a step portion between electrodes, allowing for precise placement and spread of conductive members, thereby improving manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micro LED chips are mounted using conductive paste or solder paste, then electrical connection is achieved, but precise control of feed position and feed amount becomes difficult leading to short circuits and defects
Solution Approach 1:
The patent applies preliminary action by pre-forming protrusions on the substrate surface at predetermined positions before mounting the LED chips. These protrusions serve as prepared mounting positions that guide the conductive paste or solder paste to the correct locations, ensuring accurate feed position control and preventing short circuits between adjacent electrodes.
Solution Approach 2:
The patent implements local quality by creating protrusions with specific geometric characteristics (height, diameter) at specific locations on the substrate. The protrusions have different dimensions from the surrounding flat substrate surface, providing localized structural features that enable precise control of conductive paste placement only at the necessary mounting positions without affecting other areas.
2Productivity
If protrusions are used to separate electrodes and prevent short circuits, then manufacturing yield improves, but the device structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the substrate surface into distinct regions: protrusion regions for electrode separation and flat substrate regions for other functions. The protrusions segment the conductive paste placement areas, ensuring that paste is confined to specific zones and cannot bridge between adjacent electrodes, thereby preventing short circuits and improving manufacturing yield.
Solution Approach 2:
The protrusions serve as intermediary structures between the substrate and the LED chips. They mediate the mounting process by providing a physical barrier that separates adjacent electrodes while still allowing the conductive paste to make proper electrical contact with the LED chip electrodes, thus improving yield without requiring fundamental changes to the mounting process.
Data Source
AI summary
An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 μm to 50 μm.