Micro LED Package Structure With Light-Absorbing Reflection Control
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Solution Overview
Problem
Conventional micro LED panel package structures suffer from light reflection issues, causing virtual incomplete images due to light emitted from the image display area being reflected back to the non-functional areas, which decreases image quality.
Innovation Solution
A micro package structure with a top cover plane and a seal structure that prevents light from escaping through the gap between the cover plane and the micro LED panel, using a light absorption material and spacers to absorb light and improve image quality, and a light shielding layer to prevent reflection from the non-functional areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional package structure with cover plane adhesive is used, then the micro LED panel can be assembled, but light is reflected by the non-functional area metal materials back toward the outside, producing virtual incomplete images and decreasing image quality
Solution Approach 1:
The patent extracts and removes the harmful reflective metal materials from the non-functional area, replacing them with a light absorption layer that actively absorbs stray light. This extraction of the harmful element (reflective metal) and replacement with a beneficial element (light absorption material) directly resolves the contradiction by eliminating the source of virtual image formation while maintaining the package structure.
Solution Approach 2:
The patent converts the harmful light reflection phenomenon into a beneficial light absorption function. By placing a light absorption layer in the non-functional area, the structure that previously caused harm (reflecting light to create virtual images) is transformed into a component that benefits the display by absorbing stray light and preventing virtual image formation.
2Illumination intensity
If light is emitted from the image display area, then the display function is achieved, but light escapes through the gap between the cover plane and micro LED panel, being reflected by the non-functional area and decreasing image quality
Solution Approach 1:
The patent applies preliminary anti-action by pre-establishing a light absorption layer in the non-functional area before light emission occurs. This preventive measure ensures that when light is emitted from the display area, any stray light that escapes through gaps is immediately absorbed by the pre-positioned light absorption material, preventing the harmful reflection effect before it can occur.
Solution Approach 2:
The light absorption layer acts as an intermediary between the escaping light and the non-functional area metal structures. Instead of allowing light to directly reflect off the metal surfaces, the light absorption layer intercepts the stray light first, converting it into heat energy and preventing the harmful reflection pathway.
3Reliability
If signal metal pads and dummy metal are placed in the non-functional area for electrical connection, then the electrical function is achieved, but these metal materials reflect light and produce virtual incomplete images around the objective image
Solution Approach 1:
The patent segments the non-functional area into distinct functional zones: one area dedicated to electrical connections (signal metal pads) and another area dedicated to light absorption. By spatially separating these functions and covering the metal pad area with a light absorption layer, the patent eliminates the harmful light reflection from metal surfaces while preserving the electrical connection functionality through the transparent cover plane adhesive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces light reflection, enhancing image quality by ensuring that light is directed upwards and absorbed or shielded, resulting in a clearer and more complete image display.
Implementation Method 1
using a light absorption material and spacers to absorb light and improve image quality
Implementation Method 2
a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane
Implementation Method 3
A micro package structure with a top cover plane and a seal structure that prevents light from escaping through the gap between the cover plane and the micro LED panel
Implementation Method 4
a light shielding layer to prevent reflection from the non-functional areas
Data Source
AI summary
A micro package structure includes a micro LED panel comprising an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate, the IC substrate comprising a first connected area corresponding to the micro LED array area and a second connected area away from the first connected area, a plurality of signal metal pads are formed on the second connected area; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and one or more bonding wires to connect the signal metal pads with an external circuit.