Micro LED Light Emitting Device Reflective Structures

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Solution Overview

Problem

Conventional LED light source modules suffer from reduced light emitting efficiency due to lateral lights emitted by adjacent LED chips being absorbed, leading to inefficient use of light and non-uniform emission.

Innovation Solution

A light emitting device comprising micro light emitting chips, reflective structures, and conductive bumps, where the reflective structures are positioned around the micro light emitting chips to enhance forward light flux and reduce lateral light flux, achieving better light emitting efficiency and uniformity by reflecting emitted lights.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If LED chips are arranged in a matrix on a substrate, then the device structure is compact and manageable, but lateral lights emitted by adjacent LED chips are absorbed by each other, decreasing light emitting efficiency

Engineering Contradiction:
Improvelight emitting efficiencyVSAvoidlateral light absorption
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The patent converts the harmful lateral light absorption between adjacent LED chips into a beneficial reflection by introducing reflective structures. These structures capture the lateral light that would otherwise be absorbed and redirect it forward, transforming the harmful interaction into a useful light-guiding mechanism that improves overall light emitting efficiency

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The reflective structures serve as intermediary elements positioned between adjacent LED chips. They mediate the light interaction by reflecting lateral light from one chip toward the forward direction, preventing direct absorption by neighboring chips while maintaining the compact matrix arrangement

Inventive Principle:
Principle #24Intermediary (Mediator)

2Illumination intensity

If LED chips are arranged in a matrix on a substrate, then the device structure is compact and manageable, but light emitting uniformity is reduced due to lateral light absorption

Engineering Contradiction:
Improvelight emitting uniformityVSAvoiddevice structure efficiency
Core Design Contradiction:
Illumination intensityVSProductivity

Solution Approach 1:

The reflective structures convert the harmful lateral light absorption into beneficial forward-directed light, improving illumination uniformity across the device. By redirecting lateral light that would create hotspots or dark regions, the system achieves more uniform light distribution while maintaining the compact matrix structure

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances forward light flux and achieves better light emitting efficiency and uniformity by effectively utilizing reflective structures to direct and distribute light emitted by micro light emitting chips, improving overall performance.

Implementation Method 1

reflective structures are positioned around the micro light emitting chips to enhance forward light flux and reduce lateral light flux, achieving better light emitting efficiency and uniformity by reflecting emitted lights

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS10269776B2Light emitting device
Publication Date: 2019.04.23 PLAYNITRIDE DISPLAY CO LTD
  • US10269776B2 patent drawing
  • US10269776B2 patent drawing
  • US10269776B2 patent drawing

AI summary

A light emitting device includes a substrate, micro light emitting chips, reflective structures and conductive bumps. The substrate has pads. The micro light emitting chips are disposed on the substrate separately, and each of the micro light emitting chips includes a light emitting layer, a first type electrode and a second type electrode isolated from the first type electrode, wherein the first type electrode and the second type electrode are disposed on one side of the light emitting layer. The reflective structures are physically separated from each other and spaced apart from the substrate. Each of the reflective structures is disposed around one of the micro light emitting chips. The conductive bumps and located between the micro light emitting chips and the substrate, wherein the micro light emitting chips are electrically boned to the pads of the substrate through the conductive bumps.