Micro LED Assembly Grooves for Reflow Self-Alignment
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Solution Overview
Problem
The challenge is to achieve precise positioning of semiconductor light emitting elements during the assembly process on a substrate, as current methods face difficulties in accurately placing a large number of these elements on a wiring substrate.
Innovation Solution
A method involving the growth of LEDs on a substrate, forming a member with thermal flow characteristics on the LEDs, separating them, and assembling them into assembly grooves on a wiring substrate. The reflow process is then used to self-align the LEDs to precise positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a very large number of semiconductor light emitting elements are assembled on a wiring substrate, then the display device can be implemented with reduced element size, but it becomes very difficult to precisely position the elements at desired positions
Solution Approach 1:
The patent introduces an adhesive layer with thermal flow characteristic as an intermediary between the semiconductor light emitting elements and the wiring substrate. This adhesive layer acts as a mediator that enables self-alignment during the reflow process, resolving the positioning difficulty without requiring complex assembly equipment or procedures.
Solution Approach 2:
The patent changes the physical state of the adhesive layer by controlling temperature during the reflow process. The adhesive layer transitions from a solid state during assembly to a molten state during reflow, enabling the semiconductor elements to self-align and settle into precise positions on the wiring substrate.
2Manufacturing precision
If conventional assembly methods are used to position semiconductor light emitting elements, then the assembly process can be simplified, but the positioning accuracy deteriorates
Solution Approach 1:
The patent applies the adhesive layer with thermal flow characteristic to the wiring substrate before assembling the semiconductor light emitting elements. This preliminary action prepares the substrate to enable self-alignment during subsequent reflow processing, achieving high positioning accuracy without requiring complex real-time positioning systems.
Solution Approach 2:
The semiconductor light emitting elements automatically self-align and position themselves on the wiring substrate during the reflow process through the thermal flow characteristic of the adhesive layer. This self-service mechanism eliminates the need for complex external positioning equipment or manual alignment procedures.
3Manufacturing precision
If precise positioning is achieved through complex assembly processes, then positioning accuracy improves, but manufacturing cost increases
Solution Approach 1:
The reflow process enables semiconductor light emitting elements to automatically self-align and position themselves using the thermal flow characteristic of the adhesive layer. This self-positioning mechanism eliminates the need for expensive precision positioning equipment, alignment systems, or manual operations, thereby reducing manufacturing costs while achieving high positioning accuracy.
Solution Approach 2:
The patent utilizes temperature parameter changes during the reflow process to transform the adhesive layer's physical state, enabling self-alignment. This approach replaces expensive mechanical or optical positioning systems with a simple thermal process, achieving precise positioning at lower manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances positional accuracy during the assembly of semiconductor light emitting elements, minimizes arrangement errors, and increases production yield while reducing manufacturing costs.
Implementation Method 1
forming a member having a thermal flow characteristic on at least one side surface of each of the plurality of LEDs
Implementation Method 2
performing reflow by heat on the wiring substrate having the LED assembled thereon
Data Source
AI summary
A method for manufacturing a display device can include growing a plurality of light emitting (LEDs) on a growing substrate; forming a member having a thermal flow characteristic on at least one side surface of each of the plurality of LEDs; separating each of the plurality of LEDs from the growing substrate; forming a plurality of assembly grooves in a wiring substrate for defining pixel regions; assembling the plurality of LEDs at locations respectively corresponding to the plurality of assembly grooves; and applying heat to the wiring substrate to perform a reflow process for adjusting a position of at least one of the plurality of LEDs.