Micro-LED Display Panel Reinforced Structures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro-LEDs are prone to damage or breakage during the transfer process from a growth substrate to a driving circuit substrate due to heat and pressure application, affecting the reliability of micro-LED displays.
Innovation Solution
Incorporating reinforcing structures with a lower Young's modulus than the electrode layers between the micro-LEDs and the substrate, which act as buffers to absorb stress and prevent damage during the transfer process, along with specific configurations of epitaxial layers, electrode layers, and conductive holes to enhance bonding and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat and pressure are applied to transfer micro-LEDs from growth substrate to driving circuit substrate, then electrical bonding is achieved, but micro-LEDs are damaged or break
Solution Approach 1:
The patent introduces a buffer layer between the micro-LED and the driving circuit substrate before the transfer process. This buffer layer is designed to absorb and distribute the heat and pressure stresses during the bonding process, preventing direct transmission of mechanical stress to the fragile micro-LED. The buffer layer acts as a protective cushion that mitigates the harmful effects of the bonding process, thereby preventing micro-LED damage while still achieving electrical bonding.
Solution Approach 2:
The patent employs an intermediate buffer layer structure that mediates between the micro-LED and the driving circuit substrate. This intermediate layer serves as a stress-absorbing intermediary that decouples the mechanical stresses from the micro-LED during the bonding process. The buffer layer material and structure are specifically designed to provide mechanical compliance while maintaining electrical connectivity, thus protecting the micro-LED from damage during transfer.
2Ease of manufacture
If micro-LEDs are transferred to driving circuit substrate, then display functionality is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the transfer process into distinct stages by introducing a buffer layer that can be independently optimized. The buffer layer structure is divided into multiple functional layers with different materials and properties, allowing each layer to be designed for specific functions such as stress management, thermal management, and electrical connectivity. This segmentation enables independent optimization of each component, simplifying the overall manufacturing process while maintaining functionality.
Solution Approach 2:
The buffer layer structure is designed to perform multiple functions simultaneously: mechanical stress absorption, thermal management, electrical insulation or conduction (as needed), and structural support. By integrating these multiple functions into a single buffer layer component, the patent reduces the number of separate components and processes needed, thereby simplifying the manufacturing process while achieving complex functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcing structures effectively prevent micro-LED damage and enhance the reliability of the micro-LED display panel by providing elastic deformation and improved bonding yield rates, ensuring the micro-LEDs are securely attached without cracking.
Implementation Method 1
each reinforcing structure is located between the corresponding first electrode and the corresponding second electrode, wherein a Young's modulus of each reinforcing structure is smaller than a Young's modulus of the corresponding electrode layer
Data Source
AI summary
A micro-LED display panel including a substrate, a plurality of micro-LEDs, and a plurality of reinforced structures is provided. The micro-LEDs are disposed at a side of the substrate, wherein each of the micro-LEDs comprises an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layer are located between the epitaxial layers and the substrate. Each of the micro-LEDs is electrically connected to the substrate through the corresponding electrode layer. Each of electrode layers includes a first electrode and a second electrode. The reinforced structures are disposed between the micro-LEDs and the substrate respectively, and each of the reinforced structures is located between the corresponding the first electrode and the second electrode. A Young's modulus of each of reinforced structures is smaller than a Young's modulus of the corresponding electrode layer.