Micro LED Repair Using Conductive Layer Bonding and Gas Removal
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Solution Overview
Problem
Conventional methods for repairing micro LEDs in display apparatuses are difficult due to their small size, making mass production and repair of defective micro LEDs nearly impossible.
Innovation Solution
A method and apparatus for repairing micro LEDs using a conductive material layer with both conductive and non-conductive portions, allowing for the replacement of defective LEDs with functional ones, and a gas blower for removing defective devices, combined with a substrate-based transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional die bonding technology is used to mount micro LEDs individually, then each LED can be precisely positioned, but mass production becomes almost impossible due to the enormous number of micro LEDs required and their small size
Solution Approach 1:
The patent merges multiple micro LEDs into a single integrated transfer unit or array structure, allowing them to be handled and transferred collectively rather than individually. This combining approach enables mass production by reducing the number of separate mounting operations required while maintaining precise positioning capability through the integrated structure.
Solution Approach 2:
The patent introduces an intermediary transfer substrate or carrier that holds multiple micro LEDs in predetermined positions. This intermediary structure serves as a mediator between the manufacturing process and the final display assembly, enabling batch transfer of multiple LEDs simultaneously and greatly improving productivity while maintaining manufacturing precision.
2Productivity
If micro LEDs are transferred in a group, then productivity increases, but bonding failure and poor luminescence characteristics occur in some devices
Solution Approach 1:
The patent segments the group transfer process into controlled stages, where micro LEDs are transferred in manageable batches or with individual positioning verification. The transfer substrate is designed with segmented or modular structures that allow selective release and verification of bonding quality for different groups of LEDs, maintaining reliability while preserving the productivity benefits of group transfer.
Solution Approach 2:
The patent incorporates feedback mechanisms during the group transfer process, such as real-time monitoring of bonding status and luminescence characteristics. This feedback allows for immediate detection and correction of bonding failures or poor luminescence in transferred micro LEDs, ensuring high reliability while maintaining the efficiency of group transfer operations.
3Reliability
If defective micro LEDs are replaced individually, then display quality is maintained, but the repair process becomes extremely difficult due to the small size of micro LEDs
Solution Approach 1:
The patent combines multiple replacement micro LEDs into an integrated repair unit or cartridge that can be installed as a single component. This merging approach allows defective LEDs to be replaced in groups rather than individually, dramatically reducing repair difficulty while maintaining display quality through the use of pre-tested, high-quality replacement units.
Solution Approach 2:
The patent introduces an intermediary repair substrate or carrier that holds multiple replacement micro LEDs in the correct positions and orientations. This intermediary structure serves as a handling and installation aid, allowing technicians to transfer multiple replacement LEDs simultaneously to the display assembly, making the repair process much easier while ensuring precise positioning and maintaining display quality.
Data Source
AI summary
A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.