Micro LED Panel Repair Interconnects Over a Molding Layer
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Solution Overview
Problem
The challenge in manufacturing micro LED displays lies in the precision of transferring micro LEDs to pixel array substrates, leading to alignment deviations and potential damage during placement, which results in non-functional pixels and low yield in the maintenance process due to poor electrical connections between LEDs and pads.
Innovation Solution
A display panel design featuring a circuit substrate with pad structures, conductive blocks, and a molding layer, along with conductive connection structures that improve electrical connections by forming pixel structures and allowing for efficient repair of faulty pixels through the addition of new LEDs and connection structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical transfer technology is used to transfer micro LEDs to pixel array substrates, then the manufacturing process can be completed, but alignment deviations and placement errors occur due to machine actuation errors and transfer device accuracy limitations
Solution Approach 1:
The patent replaces the mechanical transfer system with a direct growth approach where micro LEDs are grown directly on the substrate in their final positions using epitaxial growth techniques, eliminating mechanical transfer operations and associated alignment errors
Solution Approach 2:
The patent performs preliminary positioning by defining the exact locations of micro LEDs through photolithography patterns and epitaxial growth masks before the LEDs are actually grown, ensuring precise placement without mechanical transfer
2Productivity
If micro LEDs are placed using mechanical transfer devices, then the display panel can be assembled, but damage occurs to micro LEDs during the transfer and placement process
Solution Approach 1:
The patent eliminates mechanical handling of micro LEDs by growing them directly in their final positions on the substrate, preventing physical damage that would occur during mechanical pickup, transfer, and placement operations
Solution Approach 2:
The patent merges the LED growth process with the substrate fabrication process, so that micro LEDs are created and positioned simultaneously in a single integrated manufacturing flow rather than as separate transfer operations
3Ease of repair
If micro LEDs are not placed in the correct position or are damaged during transfer, then maintenance processes can repair faulty pixels, but the yield of the maintenance process is low due to poor electrical connections
Solution Approach 1:
The patent performs preliminary formation of conductive connection structures and pad structures with precise geometric configurations and material compositions before micro LEDs are grown, ensuring optimal electrical contact is already in place before the LEDs are positioned
Solution Approach 2:
The patent optimizes electrical connection quality by controlling material composition, layer thickness, and geometric parameters of the conductive structures through epitaxial growth and deposition processes, achieving low contact resistance and reliable electrical connections
Data Source
AI summary
A display panel includes a circuit substrate, pixel structures and a molding layer. The circuit substrate has first pad structures and second pad structures. The pixel structures are disposed above a display region of the circuit substrate. Each of at least a portion of the pixel structures includes a first light emitting diode, a first conductive block, and a first conductive connection structure. The first light emitting diode is disposed on a corresponding first pad structure. The first conductive block is disposed on a corresponding second pad structure. The first conductive connection structure electrically connects the first light emitting diode to the first conductive block. The molding layer is located above the circuit substrate and surrounds the first light emitting diode and the first conductive block. The first conductive connection structure is located on the molding layer.