Micro LED Replacement Bonding for Defective Display Repair
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Solution Overview
Problem
The mass production of micro LED display apparatuses is hindered by the difficulty in individually repairing defective micro LEDs due to their small size, which prevents effective bonding and luminescence, necessitating a method for efficiently replacing defective micro LEDs in a display panel.
Innovation Solution
A method involving the formation of a bonding material layer on replacement micro LEDs, which are then bonded to the circuit board using a metal bonding layer with specific compositions like AuSn, CuSn, or In, allowing for the repair of defective micro LEDs by transferring and positioning them accurately on the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional die bonding technology is used to mount micro LEDs individually, then each micro LED can be precisely positioned, but mass production becomes almost impossible due to the enormous number of micro LEDs required
Solution Approach 1:
The patent segments the micro LED array into multiple groups or blocks that can be transferred separately. Instead of mounting each micro LED individually, the invention transfers groups of micro LEDs together, dividing the enormous task into manageable segments that can be handled in batches, thereby enabling mass production while maintaining positioning precision.
Solution Approach 2:
The patent merges multiple micro LEDs into a single transfer unit or group. By combining several micro LEDs that are transferred and positioned together as a unit rather than individually, the manufacturing process achieves both efficiency for mass production and the precision required for display applications.
2Productivity
If micro LEDs are transferred in a group to enable mass production, then productivity increases, but some micro LEDs exhibit poor bonding or luminescence characteristics making repair difficult
Solution Approach 1:
The patent incorporates inspection and identification steps that detect poor bonding or luminescence characteristics in transferred micro LED groups. This feedback mechanism allows the system to identify defective micro LEDs and trigger repair operations, ensuring that reliability issues are caught and corrected while maintaining high productivity from group transfer.
Solution Approach 2:
The patent performs preliminary inspection and identification of defective micro LEDs immediately after group transfer but before final assembly completion. By detecting bonding or luminescence issues early, the system can prepare repair operations in advance, preventing defective micro LEDs from compromising the entire display while maintaining production efficiency.
3Reliability
If defective micro LEDs are replaced individually, then display quality is maintained, but the small size of micro LEDs makes picking and mounting extremely difficult
Solution Approach 1:
The patent segments the repair process by identifying and isolating only the specific defective micro LEDs within a transferred group, rather than requiring manual handling of each micro LED. The system prepares repair units that target only the problematic elements, making the repair operation feasible despite the small size of individual micro LEDs.
Solution Approach 2:
The patent introduces intermediary structures or tools that facilitate the handling and replacement of defective micro LEDs. These intermediaries act as mediators between the tiny defective micro LEDs and the manipulation system, enabling precise picking and mounting operations that would otherwise be impossible due to the microscopic size of the components.
4Ease of manufacture
If the metal bonding layer composition is made uniform across all micro LEDs, then manufacturing simplicity is maintained, but repaired micro LEDs may not achieve proper bonding characteristics
Solution Approach 1:
The patent applies local quality by allowing the metal bonding layer composition to vary for repaired micro LEDs compared to original ones. Specifically, the patent permits the metal bonding layer of repaired micro LEDs to have different thickness or composition parameters, enabling optimized bonding performance for replacement devices while maintaining uniformity for original micro LEDs, thus balancing manufacturing simplicity with repair effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient repair of micro LEDs by facilitating their bonding to the circuit board, improving the display panel's performance and manufacturing feasibility by ensuring proper bonding and luminescence characteristics.
Implementation Method 1
a metal bonding layer bonding the first pads and the second pads
Data Source
AI summary
A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.