Micro LED Mounting Groove Electrodes for Easier Replacement

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Solution Overview

Problem

In fluidic self-assembly methods for transferring ultra-small light-emitting devices like micro LEDs to a substrate, faulty devices can be identified and replaced, but damage to substrate electrode pads during removal complicates the reattachment of replacement devices.

Innovation Solution

The display module includes additional substrate electrode pads on the side walls of mounting grooves, allowing for easy reattachment of replacement LEDs by connecting to these pads via conductors, and uses magnetic posts for precise alignment during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If faulty light-emitting devices are removed from mounting grooves for replacement, then defective devices can be substituted with normal ones, but substrate electrode pads may be damaged making reattachment difficult

Engineering Contradiction:
Improveease of replacementVSAvoidelectrode pad integrity
Core Design Contradiction:
Ease of repairVSReliability

Solution Approach 1:

The substrate electrode pads are segmented into multiple groups: original pads at the bottom of mounting grooves and additional pads on the side walls. This segmentation allows the replacement process to use different pad groups, preserving the original pads from damage while enabling easy reattachment of replacement devices to the additional pads.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Additional substrate electrode pads are preliminarily provided on the side walls of mounting grooves before any replacement occurs. This preliminary preparation ensures that when faulty devices need to be removed and replaced, intact additional pads are already available for reattachment, avoiding the need to damage or reuse compromised original pads.

Inventive Principle:
Principle #10Preliminary action

2Ease of repair

If additional substrate electrode pads are provided on side walls of mounting grooves, then reattachment of replacement LEDs is facilitated, but device complexity increases

Engineering Contradiction:
Improveease of reattachmentVSAvoidelectrode pad structure
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The additional substrate electrode pads on the side walls serve multiple functions: they act as backup connection points for replacement devices, provide alternative electrical pathways, and maintain structural integrity during the replacement process. This multi-functionality justifies the added structural elements by providing versatile repair capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates efficient repair of faulty LEDs by preserving electrode pads integrity and enabling seamless reattachment, enhancing the reliability and efficiency of the display module.

Implementation Method 1

a post may be provided on a light-emitting surface of the inorganic light-emitting diode, and the post may include a magnetic layer

Methodology Applied
Scientific EffectMagnetic attraction: Magnetism

Data Source

PatentUS12568855B2Display module
Publication Date: 2026.03.03 SAMSUNG ELECTRONICS CO LTD
  • US12568855B2 patent drawing
  • US12568855B2 patent drawing
  • US12568855B2 patent drawing

AI summary

A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.