Micro-LED Transfer Using Sacrificial Posts to Eliminate Pickup Heads
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Solution Overview
Problem
Current micro-LED transfer methods using pickup heads are complex and face challenges in yield and stability, making them inefficient for high-quality micro-LED production.
Innovation Solution
A micro-LED transfer method involving the formation of sacrificial posts on a carrier substrate, bonding with a pickup substrate using a polymer layer, and transferring micro-LEDs to a receiving substrate through controlled lifting-off using different bonding layers and release mechanisms, eliminating the need for a complicated pickup head.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pickup head is used to transfer micro-LEDs, then micro-LEDs can be transferred to a receiving substrate, but the transfer process becomes complicated and yield and stability deteriorate
Solution Approach 1:
The invention extracts and eliminates the pickup head component from the transfer system. Instead of using a pickup head to grasp and transfer micro-LEDs, the method uses a carrier substrate with sacrificial posts that enable direct bonding and release of micro-LEDs, removing the complex pickup head mechanism entirely
Solution Approach 2:
The invention introduces a carrier substrate with sacrificial posts as an intermediary element. The sacrificial posts serve as temporary bonding structures that facilitate micro-LED transfer without requiring a pickup head. The posts are bonded to micro-LEDs, enable transfer to the receiving substrate, and are then removed, providing a simple intermediary mechanism
2Ease of manufacture
If a pickup head is used to transfer micro-LEDs, then micro-LED transfer can be achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The invention removes the pickup head component entirely from the manufacturing process. The transfer is achieved through a simplified process using a carrier substrate with sacrificial posts that can be bonded, transferred, and released without any pickup head structure
Solution Approach 2:
The sacrificial posts are designed as temporary, disposable structures that are bonded to micro-LEDs for transfer and then removed after serving their purpose. This eliminates the need for expensive, complex pickup head structures while achieving the same transfer function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process, improves yield and stability, and reduces costs by eliminating the need for a pickup head, enabling efficient large-scale processing and enhancing the quality of micro-LED devices.
Implementation Method 1
the melting point of the first bonding layer is lower than 280° C., and the micro-LEDs to be picked up are lifted-off from the carrier substrate through heating
Implementation Method 2
the second bonding layer is a photo resist
Implementation Method 3
the micro-LED is lifted-off from the pickup substrate through at least one of solvent dissolving, thermal release, optical release, and mechanical release
Data Source
AI summary
A micro-LED (3r) transfer method and a manufacturing method are disclosed. The micro-LED (3r) transfer method comprises: forming a sacrificial post (4) on a micro-LED (3r) to be picked-up on a carrier substrate (1); bonding the micro-LED (3r) to be picked-up with a pickup substrate (5) via the sacrificial post (4); lifting-off the micro-LED (3r) to be picked-up from the carrier substrate (1); bonding the micro-LED (3r) on the pickup substrate (5) with a receiving substrate (12); and lifting-off the micro-LED (3r) from the pickup substrate (5). A complicated pickup head is not necessary, and the technical solution is relatively simple.