Micro LED Repair Using Segmented Bonding and Conductive Layer Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The mass production of micro LED display apparatuses is hindered by conventional die bonding technologies, which result in bonding failures and poor luminescence characteristics in micro LEDs, making repair difficult due to their small size and high number requirements.
Innovation Solution
A method and apparatus for repairing micro LEDs involve a conductive material layer with both conductive and non-conductive portions, metal bonding layers, and a gas blower for removing defective LEDs, allowing for the replacement of defective micro LEDs with new ones using a temporary substrate and conductive adhesive material, facilitating efficient electrical connection and curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional die bonding technology is used to mount micro LEDs, then mass production can be attempted, but bonding failures and poor luminescence characteristics occur
Solution Approach 1:
The patent segments the bonding process into multiple stages: initial temporary mounting with temporary bonding material, followed by separate bonding of conductive material layers. This segmentation allows each bonding operation to be optimized independently, preventing the bonding failures that occur when attempting to bond everything in a single conventional die bonding step.
Solution Approach 2:
The patent introduces temporary bonding material as an intermediary substance that enables initial mounting of the micro LED without causing damage or poor luminescence. This temporary mediator allows the device to be positioned and then replaced with permanent conductive bonding material, resolving the contradiction between mass production speed and bonding reliability.
2Productivity
If conventional die bonding technology is used to mount micro LEDs, then mass production can be attempted, but luminescence characteristics deteriorate
Solution Approach 1:
The bonding process is segmented so that the micro LED is first temporarily mounted without applying excessive heat or pressure that would damage luminescence properties. The permanent conductive bonding is then applied in a controlled manner that preserves luminescence characteristics while ensuring electrical connection, thus maintaining both productivity and illumination quality.
Solution Approach 2:
The patent applies temporary bonding material beforehand as a cushioning layer that protects the micro LED during the mounting process. This temporary protective layer prevents damage to the luminescence characteristics during initial positioning, allowing subsequent permanent bonding to be performed without compromising light emission quality.
3Ease of repair
If defective micro LEDs are to be replaced, then repair can be performed, but the small size of micro LEDs makes repairment quite difficult
Solution Approach 1:
The patent segments the repair process into distinct steps: removal of defective device, application of temporary bonding material for positioning, and separate application of conductive bonding material. This segmentation makes the repair process manageable despite the small size of micro LEDs, as each step can be performed with appropriate precision tools rather than requiring complete replacement in one difficult operation.
Solution Approach 2:
The temporary bonding material serves as an intermediary that facilitates the repair process by enabling easy positioning and alignment of replacement micro LEDs. This intermediary substance makes handling and positioning easier during repair, overcoming the difficulties posed by the small size of the devices, and is later replaced with permanent conductive bonding material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective repair of micro LEDs by ensuring reliable electrical connections and maintaining the performance of micro LED display panels, overcoming the challenges of bonding failures and poor luminescence, thus enhancing the production and reliability of micro LED display apparatuses.
Implementation Method 1
a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion
Implementation Method 2
metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board
Data Source
AI summary
A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.