Micro LED Display Structure With Segmented Active Layers
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Solution Overview
Problem
Display devices using semiconductor light emitting devices face issues with reduced productivity due to separation of devices from the substrate at high temperatures, leading to a loss of adhesive force and potential damage, which affects the light emitting ability.
Innovation Solution
A display device design featuring a substrate with electrode lines and semiconductor light emitting devices connected to these lines, where each device includes multiple conductive semiconductor layers and active layers spaced apart, allowing for electrical connection through conductive adhesive layers, ensuring redundancy in light emission even if one region is damaged.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conductive adhesive is used to attach semiconductor light emitting devices to the substrate, then the devices can be securely mounted, but the adhesive loses its adhesive force at high temperatures causing device separation
Solution Approach 1:
The patent removes the conductive adhesive layer from the device structure, eliminating the component that fails at high temperatures. The semiconductor light emitting device is directly mounted to the substrate without adhesive, thereby eliminating the adhesive force loss problem while maintaining secure attachment through direct contact and electrical connection.
Solution Approach 2:
The patent introduces a new intermediary structure - a direct interface layer or mounting structure that enables both mechanical attachment and electrical connection without using conductive adhesive. This intermediary eliminates the temperature sensitivity of adhesive while maintaining the necessary functional connections.
2Manufacturing precision
If multiple semiconductor light emitting devices are placed close together for high-resolution displays, then display resolution improves, but the risk of device damage and light emitting failure increases
Solution Approach 1:
The patent segments the light emitting function into multiple independent active layers within a single semiconductor device structure. Each active layer can function independently, so if one layer is damaged, the other layers continue to emit light, maintaining display reliability while allowing close device spacing for high resolution.
Solution Approach 2:
The patent incorporates redundant active layers in advance within each semiconductor light emitting device. This beforehand cushioning ensures that even if some layers are damaged during manufacturing or operation, the device maintains light emitting capability, thereby protecting against reliability failures while enabling dense packing.
3Reliability
If redundant semiconductor light emitting devices are placed to ensure light emitting ability, then reliability improves, but device density and resolution decrease
Solution Approach 1:
The patent merges multiple light emitting functions into a single semiconductor light emitting device by stacking multiple active layers vertically. This consolidation provides redundancy within one device unit, eliminating the need for additional redundant devices while maintaining high display resolution through efficient use of device space.
Solution Approach 2:
The patent transitions from horizontal redundancy (placing multiple devices side by side) to vertical redundancy (stacking multiple active layers within one device). This dimensional change allows the system to achieve reliability through vertical stacking rather than horizontal expansion, thereby maintaining high device density and display resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains light emitting ability by distributing light emission across multiple regions, preventing the need for redundant device placement, enabling high-resolution displays with minimal device spacing.
Implementation Method 1
Light emitting diodes (LEDs), which are well known light emitting devices for converting an electrical current to light
Implementation Method 2
a conductive adhesive layer, and a second electrode, wherein the semiconductor light emitting device is electrically connected to the first electrode through the conductive adhesive layer
Data Source
AI summary
Discussed is a display device including a substrate including a plurality of electrode lines; and a plurality of semiconductor light emitting devices disposed on the substrate and electrically connected to the plurality of electrode lines; wherein each of the plurality of semiconductor light emitting devices includes: a first conductive semiconductor layer; a plurality of second conductive semiconductor layers formed on the first conductive semiconductor layer; and an active layer formed between the first and second conductive semiconductor layers, and wherein each of the plurality of semiconductor light emitting devices includes a plurality of active layers spaced apart from each other.