Micro LED Display Self-Aligned Photolithography via Conductive Adhesive

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Solution Overview

Problem

The manufacturing of display devices with micro light emitting diodes (LEDs) faces challenges in aligning openings in the filling material with conductive layers, leading to increased costs due to the need for a photo mask in photolithography processes.

Innovation Solution

The use of conductive adhesive layers, bonding layers, or reflective layers as a self-aligned photo mask during photolithography to pattern openings in the filling material, ensuring alignment with micro light emitting devices and reducing the need for a separate photo mask.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a separate photo mask is used for photolithography to pattern openings in the filling material, then the alignment between openings and conductive layers can be achieved, but the manufacturing cost increases

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The conductive adhesive layer serves as its own photomask during the photolithography process. The opaque conductive adhesive layer naturally blocks light during exposure, creating the desired pattern of openings without requiring a separate photomask. This self-service approach eliminates the need for additional photomask manufacturing and alignment steps, thereby reducing manufacturing costs while maintaining precise alignment between openings and micro light emitting devices

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The conductive adhesive layer performs multiple functions: it provides electrical connection between the bottom conductive line and the micro light emitting device, and simultaneously serves as a photomask for patterning the filling material. This multi-functionality eliminates the need for a separate photomask component, reducing both material costs and process complexity while ensuring precise alignment

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple separate photomasks are used for different layers, then each layer can be precisely patterned, but the device complexity and manufacturing steps increase

Engineering Contradiction:
Improvepattern precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the function of the conductive adhesive layer with the function of a photomask. Instead of using separate photomasks for different layers, the conductive adhesive layer itself is used as the photomask for patterning the filling material. This merging of functions reduces the number of separate components and process steps, simplifying the overall manufacturing process while maintaining the precision needed for patterning

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs by eliminating the need for a separate photo mask and ensures precise alignment of openings with micro light emitting devices, enhancing the structural and manufacturing efficiency of the display device.

Implementation Method 1

Forming at least four openings in the filling material by photolithography

Methodology Applied
Scientific EffectPhotolithography: Photography

Data Source

PatentUS10141290B2Display device and method for manufacturing the same
Publication Date: 2018.11.27 MIKRO MESA TECH
  • US10141290B2 patent drawing
  • US10141290B2 patent drawing
  • US10141290B2 patent drawing

AI summary

A method for manufacturing a display device is provided. The method includes: forming at least two bottom conductive lines on an array substrate; disposing at least four micro light emitting devices respectively on the bottom conductive lines; forming at least one filling material covering the micro light emitting devices; forming at least four openings in the filling material by photolithography, such that the micro light emitting devices are respectively exposed by the openings; and forming at least two upper conductive lines on the filling material, wherein the upper conductive lines are electrically connected to the micro light emitting devices through the openings, and the upper conductive lines and the bottom conductive lines cross at the micro light emitting devices.