Series-Connected Micro LED Chip Structure for Lower Display Power
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Solution Overview
Problem
Micro LED displays face high power consumption issues due to the need for high brightness, which is exacerbated by the driving thin-film transistors consuming more power during display.
Innovation Solution
A micro light-emitting chip structure comprising two separate sub-chips with an insulating structure and conductive elements, allowing for series connection and electrical insulation, along with a protection element to enhance structural strength and reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the driving TFTs consume more power to achieve higher brightness, then the brightness is improved, but the power consumption increases
Solution Approach 1:
The light-emitting chip is divided into two separate sub-chips (first sub-chip and second sub-chip) that are electrically insulated from each other. Each sub-chip can be independently controlled and optimized, allowing for better power management while maintaining high brightness output.
Solution Approach 2:
The patent employs alternating drive signals for the two sub-chips, where one sub-chip is activated while the other is off, and they alternate in periodic fashion. This allows the display to maintain high brightness while reducing overall power consumption by not continuously driving all light-emitting elements at full power.
2Use of energy by moving object
If the two sub-chips are electrically insulated from each other, then the power consumption is reduced, but the structural complexity increases
Solution Approach 1:
An insulating structure is introduced as an intermediary element between the two sub-chips to provide electrical insulation. This mediator allows the two sub-chips to be physically separated and electrically isolated while still being mounted on the same substrate, managing the complexity through a dedicated insulating component.
Solution Approach 2:
The insulating structure serves multiple functions: it provides electrical insulation between sub-chips, acts as a mechanical support structure, and facilitates the mounting of both sub-chips on the substrate. This multi-functionality reduces the need for additional separate components, managing structural complexity.
3Strength
If the protection element is added to cover the sub-chips and insulating structure, then the structural strength is improved, but the manufacturing complexity increases
Solution Approach 1:
The protection element is designed to simultaneously cover and protect both sub-chips and the insulating structure in a single integrated component. This merging of protection functions into one element simplifies the manufacturing process compared to applying separate protection layers to each component individually.
Solution Approach 2:
The protection element is implemented as a thin film or flexible protective layer that can conformally cover the complex three-dimensional structure of the sub-chips and insulating structure. This thin film approach provides comprehensive protection while adding minimal structural complexity and maintaining ease of manufacturing.
Data Source
AI summary
A micro light-emitting chip includes two sub-chips, an insulating structure, a conductive element, and a protection element. The insulating structure is disposed between the two sub-chips, so that the two sub-chips are electrically insulated from each other at the insulating structure. The conductive element is electrically connected to the two sub-chips. The protection element is an insulating layer and is configured on outer surfaces of the two sub-chips and the insulating structure. The protection element has a first surface and a second surface arranged along a thickness direction of the two sub-chips, and the two sub-chips and the conductive element are located between the first surface and the second surface. A micro light-emitting chip structure and a display panel are also proposed.