Micro LED Display Module With Side-Electrode Conductive Layer
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Solution Overview
Problem
The challenge in LED display devices is the miniaturization of LEDs to achieve high-quality images, as existing technologies struggle to efficiently integrate ultra-small micro LEDs with efficient electrical connections and optical performance.
Innovation Solution
A display module design featuring a substrate with pads, a light emitting diode with electrodes, a conductive connector, and a conductive layer that connects the electrodes, along with a reflective layer and adhesive layer to secure and enhance optical performance, allowing for efficient electrical connections and exposure of the light-emitting surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ultra-small micro LEDs are used to achieve high-quality images, then image quality is improved, but electrical connection efficiency deteriorates
Solution Approach 1:
The patent transitions from planar electrode connections to three-dimensional vertical connections by positioning electrodes on the side surface of the LED chip. This dimensional change allows electrical connections to be made at multiple heights and positions, improving connection reliability without increasing the chip's planar footprint, thus maintaining image quality while solving the electrical connection efficiency problem.
Solution Approach 2:
The conductive connector is designed with a nested structure that integrates multiple functional elements: the first electrode connects to the anode, the second electrode connects to the cathode, and the reflective layer is positioned within the connector structure. This nesting allows efficient electrical connections and optical enhancement within a compact volume, maintaining both image quality and connection efficiency.
2Manufacturing precision
If LED size is reduced for miniaturization, then screen resolution is improved, but electrical connection area is reduced
Solution Approach 1:
The patent moves electrical connections from the horizontal plane to the vertical dimension by placing electrodes on the side surface of the LED chip. This allows the connection area to be decoupled from the chip's planar dimensions, enabling miniaturization while maintaining adequate connection area through vertical electrode placement and conductive connector design.
Solution Approach 2:
The electrical connection system is segmented into multiple independent components: first electrode, second electrode, conductive connector, and reflective layer. This segmentation allows each component to be optimized independently, with electrodes positioned at different locations and heights, ensuring adequate connection area even as the overall LED size is reduced for higher screen resolution.
3Reliability
If conductive layer covers the LED structure for electrical connection, then electrical connectivity is improved, but light emission is blocked
Solution Approach 1:
The conductive layer is applied selectively to specific regions where electrical connections are needed, rather than covering the entire LED structure. The reflective layer is positioned to enhance light extraction from the light-emitting region. This local differentiation ensures adequate electrical connectivity while preserving light emission intensity by avoiding unnecessary coverage of the optical path.
Solution Approach 2:
The reflective layer acts as an intermediary between the conductive connector and the light-emitting region. It serves dual functions: providing electrical connection support and enhancing light extraction efficiency. This intermediary structure allows the conductive layer to perform its electrical function without directly blocking the light emission path, maintaining both connectivity and illumination intensity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-quality image output by ensuring efficient electrical connections and improved optical performance of ultra-small LEDs, enhancing screen clarity and contrast ratio.
Implementation Method 1
an adhesive layer on the substrate
Implementation Method 2
a conductive layer on the adhesive layer, the conductive layer connecting the second electrode to the conductive connector
Implementation Method 3
the connecting the first electrode and the connecting the third electrode including heat-pressing the light emitting diode and the conductive connector to the substrate
Data Source
AI summary
A display module may include: a substrate including a first pad and a common electrode pad; a light emitting diode including a first electrode connected to the first pad, and a second electrode; a conductive connector connected to the common electrode pad, and connecting the second electrode to the common electrode pad; an adhesive layer on the substrate; and a conductive layer on the adhesive layer, the conductive layer connecting the second electrode to the conductive connector, wherein the second electrode is on a side surface of the light emitting diode, the side surface being between a light emitting surface of the light emitting diode and a bottom surface of the light emitting diode that is opposite to the light emitting surface, and the light emitting surface is exposed from the conductive layer, and the conductive layer surrounds the second electrode of the light emitting diode.