Micro LED Insulation Structure With Asymmetric Sidewall Protrusions
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Solution Overview
Problem
Conventional micro LED manufacturing processes face challenges in ensuring the reliability and protection of LED chips during the mass transfer method, particularly due to potential cracking between insulation layers and material differences, which can lead to leakage and reduced illumination efficiency.
Innovation Solution
A light-emitting element design featuring a micro LED chip with a first and second surface and sidewalls, where an insulation structure entirely covers the chip, including multiple connection pads and a second insulation layer with protrusion portions on the sidewalls, which vary in length to enhance manufacturing reliability and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulation layer is disposed to cover micro LED as a protection layer, then reliability of manufacture is enhanced, but cracking between insulation layers can occur due to material differences
Solution Approach 1:
The patent applies local quality by creating protrusion portions at specific locations on the sidewalls of the insulation structure. These protrusion portions are strategically positioned to provide localized reinforcement and stress distribution, preventing cracking while maintaining the overall insulation function. The protrusion portions have different lengths depending on their position, optimizing protection where needed most.
Solution Approach 2:
The patent implements asymmetry by designing protrusion portions with varying lengths on different sidewalls and at different positions. This asymmetric configuration allows the insulation structure to better accommodate thermal expansion differences and mechanical stresses, preventing uniform cracking that would occur with symmetric designs. The asymmetric protrusions create a more resilient structure that adapts to differential stresses.
2Reliability
If an insulation structure entirely covers the LED chip, then comprehensive protection and electrical insulation are provided, but the risk of cracking increases due to material differences
Solution Approach 1:
The patent applies segmentation by dividing the continuous insulation layer into multiple sections with protrusion portions. These protrusion portions act as stress-relief segments that can independently accommodate thermal expansion and mechanical stresses, preventing crack propagation through the entire insulation structure. The segmented design maintains comprehensive coverage while reducing overall cracking risk.
Solution Approach 2:
The patent implements beforehand cushioning by incorporating protrusion portions that anticipate and prepare for thermal and mechanical stresses. These protrusions are designed in advance to absorb and distribute stresses before they can cause cracking, acting as pre-positioned stress relief features that cushion the insulation structure against harmful forces.
3Reliability
If protrusion portions with varying lengths are added to sidewalls, then cracking is prevented and illumination efficiency is improved, but device complexity increases
Solution Approach 1:
The patent applies partial action by adding protrusion portions only at critical locations on the sidewalls rather than uniformly across the entire insulation structure. The protrusion lengths are optimized to be just sufficient for stress relief at each location, avoiding excessive material addition. This partial reinforcement approach prevents cracking while minimizing the increase in device complexity.
Data Source
AI summary
A light-emitting element includes light-emitting diode (LED) chip with a first and second surface opposite to each other, and sidewalls connecting the first and second surface. The light-emitting element further includes an insulation structure covering the first surface, the second surface, and the sidewalls. The light-emitting element further includes multiple connection pads disposed on the first surface. In a cross-sectional view, the insulation layer includes a plurality of protrusion portions disposed on the sidewalls. Each of the protrusion portions protrudes from the sidewalls and extends laterally with a protrusion length. The protrusion length of one of the plurality of protrusion portions is different from that of another one of the plurality of protrusion portions.