Micro LED Light Source Assembly for Accurate Soldering and Packaging
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Solution Overview
Problem
Micro LED displays face packaging challenges such as inaccurate soldering to pads, poor electrical connections, and low reliability, hindering their adoption in the market due to their small size and high consumption.
Innovation Solution
A light source assembly with a carrier plate and arrayed light sources, featuring a concave support with metal layers and solder layers forming eutectic layers, sealed in a vacuum space, and a dimming assembly for precise light control, addressing soldering and connection issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional LED packaging structures are used, then manufacturing is simpler, but soldering accuracy and electrical connection reliability deteriorate
Solution Approach 1:
The packaging structure is divided into distinct functional modules: carrier plate with concave support for mechanical positioning, separate optical assembly for light control, and modular electrode connections. This segmentation allows each component to be optimized independently for its specific function while maintaining overall soldering accuracy and connection reliability.
Solution Approach 2:
The carrier plate includes pre-formed concave supports and positioned electrodes that prepare the mounting positions before the LED chip is installed. The optical assembly is pre-aligned with the LED chip position, ensuring accurate soldering and electrical connections are achieved through the pre-established geometric relationships and positioning features.
2Measurement precision
If micro LED chips are made smaller to increase resolution, then display quality improves, but soldering difficulty and connection reliability worsen
Solution Approach 1:
The packaging structure implements local quality enhancement through enlarged electrode pads and reinforced connection structures specifically at the soldering and electrical connection points of the micro LED chip. The carrier plate provides localized mechanical support and positioning features that compensate for the reduced size of the chip, ensuring reliable connections despite the smaller chip dimensions.
3Ease of manufacture
If packaging structure is simplified to reduce manufacturing complexity, then ease of manufacture improves, but light outgoing effect and sealing quality worsen
Solution Approach 1:
The optical assembly is merged with the carrier plate structure, where the optical components are integrated into the same structural framework that provides mechanical support and sealing. This merging allows the light control function to be achieved without adding separate complex packaging structures, maintaining manufacturing simplicity while ensuring proper light outgoing effect through the integrated optical paths and light extraction features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves soldering yield and reliability, enabling the assembly to be applied in display devices, touch screen modules, and backlight modules with enhanced light and thin design capabilities.
Implementation Method 1
A second electrode layer is arranged on a side of the first electrode layer facing away from the substrate. The second electrode layer reacts with a target solder that permeates the third electrode layer to form a stable soldering layer.
Implementation Method 2
The concave support and the optical assembly are sealed to form a sealed vacuum space.
Data Source
AI summary
A light source assembly is applicable to an LED device, a display device, or a backlight module. The light source assembly includes a carrier plate and a plurality of light sources arranged above the carrier plate in an array. Packaging problems (for example, how to improve a soldering yield of light source packaging) of the light sources may be solved through a packaging structure of the light source assembly. Moreover, based on the improved packaging structure of the light source assembly, the manufactured light source assembly is applicable to the LED device, the display device, a touch screen structure module of the display device, or the backlight module, and the carrier plate and the plurality of light sources have excellent packaging characteristics.