Micro LED Transfer Layout for Uniform Brightness Across Splice Areas

The patent applies asymmetry by rotating the transfer head 180 degrees when moving from one transfer area to another. This rotational asymmetry compensates for the thickness variation of micro LEDs across the wafer surface, ensuring that LEDs from different radial positions are distributed uniformly across multiple transfer areas, thereby eliminating brightness differences while maintaining high transfer efficiency

The patent implements preliminary action by pre-planning the transfer sequence and rotation angles before the actual transfer process. The transfer head rotation angles are predetermined based on the wafer map data, allowing the system to compensate for thickness variations before transfer begins, ensuring uniform thickness distribution across all transfer areas

The patent applies segmentation by dividing the overall transfer process into multiple smaller transfer operations, each handling a portion of the display substrate. The transfer head processes multiple transfer areas sequentially with 180-degree rotations, breaking down the large-area transfer into manageable segments that maintain uniform light field distribution while preserving high transfer speed

The patent implements dynamics by making the transfer head rotation angle variable depending on the current transfer area being processed. The system dynamically adjusts the rotation angle by 180 degrees between adjacent transfer areas, allowing the transfer process to adapt to position-dependent thickness variations and maintain uniform light field distribution across the entire display substrate