Micro-LED Substrate with Colloid Fixing for Direct TFT Integration
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Solution Overview
Problem
The manufacturing method for large-sized micro-LED display panels faces low production yield due to the difficulty of seamless splicing of small-sized display panels.
Innovation Solution
An LED substrate with a hard substrate, colloid, and micro-LED chips is used, where the LED chips have opposite end surfaces for connection with thin film transistor substrates, and are fixedly set on the substrate using a colloid, with concave parts and an auxiliary photoresist layer to facilitate direct integration of thin film transistor substrates without splicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If small-sized display panels are spliced to form large-sized display panels, then the display size is increased, but the production yield decreases due to the difficulty of seamless splicing
Solution Approach 1:
The patent divides the LED chips into multiple groups, with each group corresponding to a separate thin film transistor substrate. This segmentation allows each substrate to be independently manufactured and tested, then assembled together to form the large display panel, avoiding the need for complex seamless splicing while maintaining high production yield
Solution Approach 2:
The patent implements preliminary actions by pre-attaching LED chip groups to temporary substrates and pre-testing thin film transistor substrates before final assembly. This preliminary preparation ensures that only qualified components are integrated into the final large-sized display panel, improving production yield while achieving the desired display size
2Area of stationary object
If multiple small-sized display panels are integrated by splicing, then the display area is enlarged, but the manufacturing complexity increases
Solution Approach 1:
The patent introduces temporary substrates as intermediaries to hold LED chip groups during the manufacturing process. These temporary substrates simplify the assembly process by providing a stable platform for LED chip attachment, which can then be easily transferred and integrated with thin film transistor substrates, significantly reducing splicing complexity
Solution Approach 2:
The patent segments the manufacturing process into independent stages: LED chip group preparation on temporary substrates, thin film transistor substrate preparation, and final integration. This segmentation transforms a complex splicing operation into manageable, standardized steps that are easier to execute and control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the direct formation of large-sized LED display panels with improved yield by simplifying the manufacturing process and reducing the complexity of splicing, resulting in a more efficient production of micro-LED display panels.
Implementation Method 1
a colloid set on the substrate; and a plurality of LED chips... the second end surface of the LED chips is fixedly set on the substrate by the colloid
Data Source
AI summary
The present application provides an LED substrate and a method for manufacturing an LED display panel. The LED substrate comprises a substrate, a colloid, and LED chips. The colloid is set on the substrate, and the LED chips comprise a first end surface and a second end surface, wherein the first end surface and the second end surface are set opposite to each other, the first end surface is for fixedly connecting a thin film transistor substrate, and the second end surface is a light outputting surface. The second end surface of the LED chips is fixedly set on the substrate by the colloid.