Micro LED Substrate with Overlapping Side Wires for Light Extraction
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Solution Overview
Problem
Current LED technologies face challenges in maximizing light emitting efficiency, which limits their application in various lighting applications due to suboptimal light extraction and emission symmetry.
Innovation Solution
A device substrate design featuring a micro light emitting element with a first and second semiconductor layer, connected by wires that allow light emission from at least three sides, enhancing light extraction and emission efficiency while maintaining symmetry of the light field.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED structure is used, then manufacturing is simple, but light extraction efficiency is insufficient
Solution Approach 1:
The patent transitions from conventional top-emitting LED structure to a lateral emitting structure where light is extracted from the side surfaces of the semiconductor layers. This dimensional change enables light to escape from multiple directions (top and sides) rather than only from the top surface, significantly improving light extraction efficiency while maintaining manufacturing feasibility through standard semiconductor fabrication processes
Solution Approach 2:
The LED structure is segmented into distinct first and second semiconductor layers with different orientations. The first semiconductor layer emits light from its top surface while the second semiconductor layer emits light from its side surface. This segmentation allows each layer to be optimized for its specific emission direction, achieving high light extraction efficiency from multiple directions simultaneously
2Reliability
If wires are placed on semiconductor layers for electrical connection, then electrical connectivity is achieved, but light emission symmetry is compromised
Solution Approach 1:
The patent extracts the wires from the semiconductor layer surface and relocates them to the substrate level. The wires are embedded in the substrate and make electrical contact with the semiconductor layers at their bottom surfaces, rather than being placed on top of the light-emitting regions. This extraction preserves the symmetry of the light field by keeping the semiconductor layer surfaces clear of obstructions
Solution Approach 2:
The substrate serves as an intermediary that facilitates electrical connection between the wires and the semiconductor layers. By embedding wires in the substrate and having them contact the semiconductor layers at the substrate-semiconductor interface, the patent achieves reliable electrical connectivity without compromising the light emission symmetry of the semiconductor layer surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves light extraction and emission efficiency, allowing for better light distribution and symmetry, potentially expanding LED applications in lighting solutions.
Implementation Method 1
a micro light emitting element disposed on the receiving substrate, the micro light emitting element comprising a first type semiconductor layer and a second type semiconductor layer
Data Source
AI summary
A device substrate includes a receiving substrate, a micro light emitting element, a first wire, and a second wire is provided. The micro light emitting element is disposed on the receiving substrate. The micro light emitting element includes a first type semiconductor layer and a second type semiconductor layer. The first type semiconductor layer is disposed on the receiving substrate and has a first wire connecting surface away from the receiving substrate. The second type semiconductor layer is disposed on a part of the first type semiconductor layer and has a second wire connection surface away from the receiving substrate. The first wire is disposed on the first wire connection surface. The second wire is disposed on the second wire connection surface. A projection range of the first wire perpendicularly projected on the micro light emitting element and a projection range of the second wire perpendicularly projected on the micro light emitting element are at least partially overlap.