Micro LED Panel Testing Path for Pre-Cover Defect Replacement
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Solution Overview
Problem
In traditional micro LED display panel manufacturing, replacing a defective vertical micro LED covered by a flat layer is complex and costly due to the difficulty in accessing and replacing covered LEDs, leading to reduced production yield and increased costs.
Innovation Solution
A manufacturing method involving the use of bumps and a transparent conductive layer to form a test path for electrical connection and testing before the photolithography process, allowing damaged LEDs to be identified and replaced promptly, thereby simplifying the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat layer is disposed on vertical micro LEDs to complete electrical connection, then electrical connection is achieved, but the micro LED becomes difficult to replace and process complexity increases
Solution Approach 1:
The patent performs testing on vertical micro LEDs before they are covered by the flat layer. By conducting electrical connection tests and identifying defective LEDs in advance, the system allows for replacement of faulty components before the flat layer is applied, thus avoiding the complexity of replacing covered LEDs later while still achieving reliable electrical connections in the final product
2Reliability
If testing is performed after flat layer deposition, then electrical connection is verified, but defective micro LEDs cannot be easily replaced leading to reduced productivity
Solution Approach 1:
The patent performs lighting tests and electrical verification before the flat layer is deposited on the vertical micro LEDs. This preliminary testing allows defective LEDs to be identified and replaced while they are still accessible, preventing defective units from being trapped under the flat layer and thereby improving production yield and efficiency
3Reliability
If vertical micro LEDs are covered with flat layer for electrical connection, then connection is completed, but replacement difficulty increases leading to increased manufacturing cost
Solution Approach 1:
The patent implements testing and identification of defective vertical micro LEDs before the flat layer is applied. By performing this preliminary screening, defective units can be replaced with functional ones before final assembly, avoiding the need for complex rework procedures later and reducing overall manufacturing costs while ensuring reliable electrical connections
Data Source
AI summary
A micro LED display panel includes a circuit substrate, multiple vertical micro LEDs, a substrate, multiple bumps, and a transparent conductive layer. Each vertical micro LED is electrically connected to the circuit substrate by a first electrode thereof. The bumps are disposed on a surface of the substrate, and respectively correspond to second electrodes of the vertical micro LEDs. The transparent conductive layer is disposed on the surface of the substrate, and the bumps are located between the transparent conductive layer and the substrate. Each vertical micro LED is electrically connected to the transparent conductive layer by the second electrode thereof. A manufacturing method of a micro LED display panel is also provided.