Micro LED Display Module With TGV Wiring for Bezel-Less Layout
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Solution Overview
Problem
Existing display devices face challenges in achieving a bezel-less design and optimizing the position and heat dissipation of the display driver IC (DDI) due to the need for separate side wires and components.
Innovation Solution
The implementation of a through glass via (TGV) connection between micro LEDs and an external circuit on a glass panel, along with a film substrate that directly couples to a printed circuit board (PCB) on the rear surface of the display substrate, eliminating the need for separate side wires and allowing for improved DDI positioning and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If separate side wires are used to connect micro LEDs to external circuits, then electrical connection is achieved, but the display area is reduced and bezel-less design cannot be realized
Solution Approach 1:
The patent transitions the electrical connection approach from a lateral/dimensional wiring structure (side wires extending along the edges) to a vertical/dimensional structure (through-glass vias penetrating the glass substrate thickness). This allows connections to be made through the glass panel rather than around its edges, enabling the entire front surface to be used as display area while maintaining electrical connectivity to external circuits.
Solution Approach 2:
The patent extracts and removes the separate side wire components from the display structure. Instead of having distinct lateral connection elements, the wiring is integrated directly into the glass substrate through through-glass vias, eliminating the need for separate side wire assemblies and their associated mounting structures.
2Ease of manufacture
If DDI is positioned in a fixed location on the display module, then manufacturing is simplified, but heat dissipation performance is compromised
Solution Approach 1:
The patent introduces positioning holes in the glass substrate that allow the DDI to be positioned at multiple locations rather than a single fixed position. This dynamic positioning capability enables the DDI to be placed in locations optimized for heat dissipation (such as near heat sinks or ventilation areas) while still maintaining electrical connections through the flexible wiring structure, without complicating the manufacturing process.
3Area of stationary object
If through glass via connection is implemented, then bezel-less display is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functions into the glass substrate: it serves as both the display panel and the mounting structure for electrical connections. The through-glass vias integrate the wiring function directly into the glass substrate, eliminating the need for separate wire harnesses and their associated mounting brackets, clips, or adhesives. This consolidation reduces the number of manufacturing steps and assembly operations required.
Solution Approach 2:
The glass substrate is designed to perform multiple functions simultaneously: it acts as the protective cover, the mounting platform for micro LEDs, the structural support, and the electrical connection medium through integrated through-glass vias. This multi-functionality reduces the overall component count and simplifies the manufacturing process compared to traditional designs requiring separate elements for each function.
Data Source
AI summary
A display module includes a display substrate including a front surface and a rear surface opposite to the front surface, an array of pixels on the front surface, wherein a plurality of micro light emitting diodes (LEDs) are in each pixel, a plurality of through vias in the display substrate and that extend from the front surface to the rear surface, a printed circuit board (PCB) on the rear surface of the display substrate, and a film substrate on the rear surface of the display substrate and including a first coupling portion coupled to at least one of the through vias, a second coupling portion coupled to the PCB, and a connection portion that connects the first coupling portion and the second coupling portion. Each of the through vias is electrically connected to at least one pixel in the array of pixels.